한국섬유공학회지 (Textile Science and Engineering)

  • 제60권5호
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  • Pages.313-320
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  • 2023
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  • 1225-1089(pISSN)
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  • 2288-6419(eISSN)
한국섬유공학회 (The Korean Fiber Society)
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1 마이크로 이하 슬러리 여과용 CMP 필터 적층구조 최적화

Optimization of CMP Filter Layered Structure for Slurry Filtration of Less than 1 Micron

  • 채효정 (한국섬유기계융합연구원) ;
  • 김경도 ((주)GH신소재) ;
  • 김삼수 (영남대학교 파이버시스템공학과)
  • Hyo-Jung Chae (Korea Textile Machinery Convergence Research Institute) ;
  • Kyung-Do Kim (GH Advanced Materials) ;
  • Sam-Soo Kim (Department of Fiber System Engineering, Yeungnam Unversity)
  • 투고 : 2023.07.30
  • 심사 : 2023.08.29
  • 발행 : 2023.10.31
⟨ 이전 논문 다음 논문 ⟩

초록

The particles contained in the slurry used as an abrasive in the CMP are approximately 1 ㎛ or larger in size, causing micro-scratches on the surface of the wafer during the CMP process. Furthermore, the particles are easily coagulated in the slurry supply line and form large agglomerated particles, which significantly affects the device. Filtration technology is required to remove large particles (1 ㎛ or larger), compounds, or gels in the slurry. Depth filtration is suitable for slurries with high particle concentration and viscosity. The slurry can be filtered through a mechanism that removes particles by trapping them inside the filter while passing through nonlinear paths (tortuosity) in the media layer (thickness of a few mm to tens of mm). Therefore, this study analyzed the filter performance (differential pressure and removal efficiency) by optimizing the number of stacked layers of nanofibers (fine pore size) and melt-blown nonwovens (fine diameter) to control the filter pore size; thus, the particles larger than a certain size are selectively captured and removed within the filter structure in the CMP process, and small particles below a certain size (1 ㎛) pass through the filter for wafer polishing.

키워드

과제정보

본 논문은 2021년도 정부(산업통상자원부)의 재원으로 한국산업기술진흥원의 지원으로 수행되었으며, 이에 감사드립니다(과제번호 20016326, 2021 차세대지능형 반도체기술개발사업).

참고문헌

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