반도체디스플레이기술학회지 (Journal of the Semiconductor & Display Technology)

한국반도체디스플레이기술학회 (The Korean Society Of Semiconductor & Display Technology)
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Development of a Die Ejector Using Thermopneumatic System

  • 투고 : 2023.06.16
  • 심사 : 2023.09.07
  • 발행 : 2023.09.30
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초록

Recently, in the semiconductor industry, memory device market is focusing on producing ultra-thin wafers for high integration. In the wafer manufacturing process, wafers after backgrinding and CMP process must be picked up as individual dies and subjected to be peeled off from the dicing tape. However, ultra-thin dies are vulnerable to the possibility of breakage and failure in their thickness and size. This research studies the mechanism of peeling a die with a high-aspect ratio using a thermopneumatic method instead of a die ejector with physical pins. Setting compressed air and the temperature as main factors, we determine the success of the digester using thermopneumatic system and analyze the good die to find the possibility of making mass-production equipment.

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과제정보

본 연구는 정부 산업통상자원부의 '차세대 지능형 반도체 기술 개발(설계, 제조)-반도체 제조공정장비 사업'의 지원을 받아 수행된 연구 결과입니다[과제명: 고직접 반도체 검사용 마이크로 반도체 소켓, 과제번호: 20023152].

참고문헌

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