과제정보
이 연구는 2023년도 산업통상자원부 및 산업기술평가관리원(KEIT) 연구비 지원(RS-2023-00227306) 및 2022년도 정부(산업통상자원부)의 재원으로 한국산업기술진흥원의 지원을 받아 수행된 연구임(P0012451, 2022년 산업혁신인재성장지원사업).
참고문헌
- M. Marezio and J. P. Remeika, J. Chem. Phys., 46, 1862 (1967). doi: https://doi.org/10.1063/1.1840945
- V. M. Bermudez, Chem. Phys., 323, 193 (2006). doi: https://doi.org/10.1016/j.chemphys.2005.08.051
- H. Y. Playford, A. C. Hannon, M. G. Tucker, D. M. Dawson, S. E. Ashbrook, R. J. Kastiban, J. Sloan, and R. I. Walton, J. Phys. Chem. C, 118, 16188 (2014). doi: https://doi.org/10.1021/jp5033806
- S. Yoshioka, H. Hayashi, A. Kuwabara, F. Oba, K. Matsunaga, and I. Tanaka, J. Phys.: Condens. Matter, 19, 346211 (2007). doi: https://doi.org/10.1088/0953-8984/19/34/346211
- H. Y. Playford, A. C. Hannon, E. R. Barney, and R. I. Walton, Chem. Eur. J., 19, 2803 (2013). doi: https://doi.org/10.1002/chem.201203359
- D. Guo, Z. Wu, P. Li, Y. An, H. Liu, X. Guo, H. Yan, G. Wang, C. Sun, L. Li, and W. Tang, Opt. Mater. Express, 4, 1067 (2014). doi: https://doi.org/10.1364/OME.4.001067
- D. Guo, Q. Guo, Z. Chen, Z. Wu, P. Li, and W. Tang, Mater. Today Phys., 11, 100157 (2019). doi: https://doi.org/10.1016/j.mtphys.2019.100157
- M. Higashiwaki, K. Sasaki, A. Kuramata, T. Masui, and S. Yamakoshi, Appl. Phys. Lett., 100, 013504 (2012). doi: https://doi.org/10.1063/1.3674287
- T. Park, S. Park, J. H. Park, J. Y. Min, Y. Jung, S. Kyoung, T. Y. Kang, K. Kim, Y. S. Rim, and J. Hong, Nanomaterials, 12, 2983 (2022). doi: https://doi.org/10.3390/nano12172983
- J. Wang, Y. Xiong, L. Ye, W. Li, G. Qin, H. Ruan, H. Zhang, L. Fang, C. Kong, and H. Li, Opt. Mater., 112, 110808 (2021). doi: https://doi.org/10.1016/j.optmat.2021.110808
- Y. Yuan, W. Hao, W. Mu, Z. Wang, X. Chen, Q. Liu, G. Xu, C. Wang, H. Zhou, Y. Zou, X. Zhao, Z. Jia, J. Ye, J. Zhang, S. Long, X. Tao, R. Zhang, and Y. Hao, Fundam. Res., 1, 697 (2021). doi: https://doi.org/10.1016/j.fmre.2021.11.002
- D. Y. Guo, Z. P. Wu, Y. H. An, P. G. Li, P. C. Wang, X. L. Chu, X. C. Guo, Y. S. Zhi, M. Lei, L. H. Li, and W. H. Tang, Appl. Phys. Lett., 106, 042105 (2015). doi: https://doi.org/10.1063/1.4907174
- S. C. Siah, R. E. Brandt, K. Lim, L. T. Schelhas, R. Jaramillo, M. D. Heinemann, D. Chua, J. Wright, J. D. Perkins, C. U. Segre, R. G. Gordon, M. F. Toney, and T. Buonassisi, Appl. Phys. Lett., 107, 252103 (2015). doi: https://doi.org/10.1063/1.4938123
- W. F. Wu, B. S. Chiou, and S. T. Hsieh, Semicond. Sci. Technol., 9, 1242 (1994). doi: https://doi.org/10.1088/0268-1242/9/6/014
- S. Yu, W. Xu, H. Zhu, W. Qiu, Q. Fu, and L. Kong, J. Alloys Compd., 883, 160622 (2021). doi: https://doi.org/10.1016/j.jallcom.2021.160622
- M. Lee, Y. Park, K. Kim, and J. Hong, Thin Solid Films, 703, 137980 (2020). doi: https://doi.org/10.1016/j.tsf.2020.137980
- Y. Huang, H. Wu, Y. Zhi, Y. Huang, D. Guo, Z. Wu, P. Li, Z. Chen, and W. Tang, Appl. Phys. A, 124, 611 (2018). doi: https://doi.org/10.1007/s00339-018-2037-z
- A. Van Dijken, E. A. Meulenkamp, D. Vanmaekelbergh, and A. Meijerink, J. Lumin., 90, 123 (2000). doi: https://doi.org/10.1016/S0022-2313(99)00599-2