과제정보
논문은 2022년도 정부(산업통상자원부)의 재원으로 한국산업기술진흥원(P0008458, 2022년 산업혁신인재성장지원사업)의 지원과 정부(과학기술정보통신부)의 재원으로 한국연구재단의 지원(No. 2021R1A2C1009714)을 받아 작성되었습니다.
참고문헌
- K. Y. Kim, K. D. Min, Y. I. Kim, J. W. Yoon, and S. B. Jung, "The effect of environmental test on the shear strength of the ultrasonic bonded Cu terminal for power module", J. Weld. Join., 37(2), 1-6 (2019). https://doi.org/10.5781/JWJ.2019.37.2.1
- D. H. Jung, M. H. Roh, J. H. Lee, K. H. Kim, and J. P. Jung, "Transient Liquid Phase (TLP) Bonding of device for high temperature operation", J. Microelectron. Electron. Packag., 24(1), 17-25 (2017). https://doi.org/10.6117/kmeps.2017.24.1.017
- S. J. Baek, G. W. Jeong, J. H. Son, M. S. Kim, H. B. R. Lee, J. S. Kim, and Y. H. Ko, "Interfacial re actions and mechanical properties of transient liquid-phase bonding joints in Cu/Sn/Ni (P) and Ni/Sn/(OSP) Cu structures for power modules", J. Mater. Sci.: Mater. Electron, 32, 3324-3333 (2021). https://doi.org/10.1007/s10854-020-05080-1
- Y. Cheon, "Review of global carbon neutral strategies and technologies", J. Korean Soc., 59(1), 99-112 (2022). https://doi.org/10.32390/ksmer.2022.59.1.099
- J. W. Yoon, J. H. Bang, Y. H. Ko, S. H. Yoo, J. K. Kim, and C. W. Lee, "Power module packaging technology with extended reliability for electric vehicle applications", J. Microelectron. Electron. Packag., 21(4), 1-13 (2014). https://doi.org/10.6117/kmeps.2014.21.4.001
- H. J. Kang and J. P. Jung, "TLP and wire bonding for power module", J. Microelectron. Electron. Packag., 26(4), 7-13 (2019).
- I. Nistor, A. Mihaila, M. Rahimo, L. Storasta, and C. Corvasce, "Wide bandgap power devices in megawatt applications", Power Electronics Europe, 4, 35 (2012).
- M. K. Kim and S. W. Yoon, "Miniaturized design of a piezoelectric thermal sensor optimized for the integration to wide bandgap power modules operating at high temperatures", In 2017 IEEE Applied Power Electronics Conference and Exposition (APEC), 767-771 (2017).
- L. Yang, Y. Xiong, Y. Zhang, W. Jiang, and D. Wei, "Microstructure and shear property of In-Sn-xAg solder joints fabricated by TLP bonding", J. Mater. Sci.: Mater. Electron., 30, 18211-18219 (2019). https://doi.org/10.1007/s10854-019-02175-2
- W. S. Hong and C. M. Oh, "Degradation behavior of solder joint and implementation technology for lead-free automotive electronics", J. Weld. Join., 31(3), 22-30 (2013). https://doi.org/10.5781/KWJS.2013.31.3.22
- J. H. Son, M. K. Kim, D. Y. Yu, Y. H. Ko, J. W. Yoon, C. W. Lee, Y. B. Park, and J. H. Bang, "Thermal aging characteristics of Sn-xSb solder for automotive power module", J. Weld. Join., 35(5), 38-47 (2017). https://doi.org/10.5781/JWJ.2017.35.5.6
- N. Y. Lee, J. H. Lee, and C. Y. Hyun, "Chip sinter-bonding using Ag-based paste for power semiconductor devices", J. Weld. Join., 37(5), 482-492 (2019). https://doi.org/10.5781/JWJ.2019.37.5.8
- H. Feng, J. Huang, X. Peng, Z. Lv, Y. Wang, J. Yang, S. Chen, and X. Zhao, "Microstructural evolution of Ni-Sn transient liquid phase sintering bond during high-temperature aging", J. Electron. Mater., 47, 4642-4652 (2018). https://doi.org/10.1007/s11664-018-6336-0
- H. Xu, Y. Shen, Y. Hu, J. Li, and J. Xu, "Fabrication of highly reliable joint based on Cu/Ni/Sn double-layer powder for high temperature application", J. Microelectron. Electron. Packag., 16(4), 188-195 (2019). https://doi.org/10.4071/imaps.960671
- J. F. Silvain, L. Constantin, J. M. Heintz, S. Bordere, L. Teule-Gay, Y. F. Lu, J. L. Diot, R. D. Langlade, and E. Feuillet, "Controlling interfacial exchanges in liquid phase bonding enables formation of strong and reliable Cu-Sn soldering for high-power and temperature applications", ACS Appl. Electron. Mater., 3(2), 921-928 (2021). https://doi.org/10.1021/acsaelm.0c01040
- D. Ishikawa, B. N. An, M. Mail, H. Wurst, B. Leyrer, T. Blank, M. Weber, S. Ueda, H. Nakako, and Y. Kawana, "Analysis of bonding interfaces of pressureless-sintered Cu on metallization layers", In 2019 International Conference on Electronics Packaging (ICEP), 167-172 (2019).
- D. H. Lee, M. H. Heo, and J. W. Yoon, "Recent studies of transient liquid phase bonding technology for electric vehicles", J. Weld. Join., 40(3), 233-241 (2022). https://doi.org/10.5781/JWJ.2022.40.3.4
- J. H. Lee, D. H. Jung, and J. P. Jung, "Transient liquid phase diffusion bonding technology for power semiconductor packaging", J. Microelectron. Electron. Packag., 25(4), 9-15 (2018).
- Z. Li, M. Li, Y. Xiao, and C. Wang, "Ultrarapid formation of homogeneous Cu6Sn5 and Cu3Sn intermetallic compound joints at room temperature using ultrasonic waves", Ultrason Sonochem., 21(3), 924-929 (2014). https://doi.org/10.1016/j.ultsonch.2013.09.020
- J. W. Yoon, M. H. Heo, Y. J. Seo, D. H. Lee, M. S. Jeong, and H. T. Kim, "Semiconductor device bonding material comprising solder-coated metal foam", Korea patent 10-2022-0126915, filed October 4, 2022.
- W. Zhang, Y. Cao, J. Huang, W. Zhao, X. Liu, M. Li, and H. Ji, "Ultrasonic-accelerated metallurgical reaction of Sn/Ni composite solder: Principle, kinetics, microstructure, and joint properties", Ultrason Sonochem., 66, 105090 (2020).
- H. Feng, J. Huang, J. Zhang, X. Zhai, X. Zhao, and S. Chen, "High temperature resistant Ni-Sn transient liquid phase sintering bonding for new generation semiconductor power electronic devices", In 2015 IEEE 17th Electronics Packaging and Technology Conference (EPTC), 1-4 (2015).