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Solder Alloy Types and Solder Joint Reliability Evaluation Techniques

솔더 합금 종류 및 솔더 조인트의 신뢰성 평가 기법

  • You-Gwon Kim (Department of Mechanical Convergence Engineering, Hanyang University) ;
  • Heon-Su Kim (Department of Mechanical Convergence Engineering, Hanyang University) ;
  • Tae-Wan Kim (Department of Mechanical Convergence Engineering, Hanyang University) ;
  • Hak-Sung Kim (Department of Mechanical Convergence Engineering, Hanyang University)
  • 김유권 (한양대학교 융합기계공학과) ;
  • 김헌수 (한양대학교 융합기계공학과) ;
  • 김태완 (한양대학교 융합기계공학과) ;
  • 김학성 (한양대학교 융합기계공학과)
  • Received : 2023.03.02
  • Accepted : 2023.03.30
  • Published : 2023.03.30

Abstract

In this paper, a method for evaluating the reliability of solder joints is introduced, as they play a crucial role in packaging technology due to the miniaturization and high-performance requirements of electronic device. Firstly, properties of solder based on various alloy compositions and solder types are described, followed by an analysis of solder joint structures in different packages. Next, the influence of solder alloy composition and microstructure on the thermal and mechanical properties of solder is analyzed, and solder creep behavior is briefly introduced. Subsequently, analytical techniques considering creep models and fatigue models for reliability evaluation are presented, and various ways to improve the reliability of solder joints are discussed. This study is expected to provide valuable information for evaluating and enhancing the reliability of solder joints in the semiconductor packaging technology field.

본 논문에서는 전자제품의 소형화와 고성능화에 따라 패키징 기술에서 핵심적인 역할을 하는 솔더 조인트의 신뢰성 평가 방법을 소개한다. 우선, 다양한 합금 조성과 제품 형태에 따른 솔더의 특성을 설명하고, 여러 패키지에서의 솔더 조인트 구조에 대한 개요를 제시한다. 그 다음 솔더 합금의 조성과 미시구조가 솔더의 열적 및 기계적 특성에 미치는 영향을 분석하며, 솔더 크리프 거동에 대해 간략히 소개한다. 이어서, 신뢰성 평가를 위한 크리프 모델과 피로 모델 등을 고려한 분석 기법들을 소개하고, 솔더 조인트의 신뢰성을 향상시킬 수 있는 방안에 대해 논의한다. 본 연구는 반도체 패키징 기술 분야에서 솔더 조인트의 신뢰성 평가와 개선에 유익한 정보를 제공할 것으로 기대된다.

Keywords

Acknowledgement

This work was supported by Korea Institute of Energy Technology Evaluation and Planning(KETEP) grant funded by the Korea government(MOTIE)(20202020800360, Innovative Energy Remodeling Total Technologies(M&V, Design, Package Solutions, and Testing & Verifications Technologies) for the Aging Public Buildings). This research was also supported by a National Research Foundation of Korea (NRF) grant funded by the Korean Government (MEST) (2021M2E6A1084690), This work was supported by Korea Institute of Energy Technology Evaluation and Planning(KETEP) grant funded by the Korea government(MOTIE)(20212020800090, Development and Demonstration of Energy-Efficiency Enhanced Technology for Temperature-Controlled Transportation and Logistics Center)

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