참고문헌
- W. J. Daukler, D. J. Resnick, W. A. Johnson, A. W. Yanof, A new operating regime for electroplating the gold absorber on x-ray masks, Microelectron. Eng., 23 (1994) 235-238. https://doi.org/10.1016/0167-9317(94)90145-7
- W. Chu, M. L. Schattenburg, H. I. Smith, Low-stress gold electroplating for X-ray masks, Microelectron. Eng., 17 (1992) 223-226. https://doi.org/10.1016/0167-9317(92)90046-T
- T. Osaka, Y. Okinakab, J. Sasano, M. Katod, Development of new electrolytic and electroless gold plating processes for electronics applications, Sci. Technol. Adv. Mater., 7 (2006) 425-437. https://doi.org/10.1016/j.stam.2006.05.003
- Y. Yoneda, K. Nakamura, Packaging technology for imaging LSI, Fujitsu, 63 (2012) 489-495.
- Y. Ejiri, T. Sakurai, Y. Arayama, K. Suzuki, Y. Tsbomatsu, S. Hatakeyama, S. Arike, Y. Hiroyama, K. Hasegawa, Electroless Ni/Pd/Au plating for semiconductor package substrates (I) - influence of the electroless Ni plating thickness on the solder ball joint reliability, J. Japan Inst. Electron. Packag., 15 (2012) 82-95. https://doi.org/10.5104/jiep.15.82
- I. Kato, H. Terashima, H. Watanabe and H. Honma, Influence of electroless Ni-P film condition on wire bondability, J. Surf. Finish. Soc. Jpn., 62(1) (2011) 47-53. https://doi.org/10.4139/sfj.62.47
- J. Ushio, O. Miyazawa, H. Yokono, A. Tomizawa, Electronic device plated with gold by means of an electroless gold plating solution, European Patent Application EP 021789, April 29 (1987)
- I. Takashi, Development of a non-cyanide electroless gold plating bath, Surf. Finish. Soc. Jpn., 52 (2001) 410. https://doi.org/10.4139/sfj.52.410
- Y. Shindo, H. Honma, Study of non-cyanide electroless gold plating, Proceeding of the 84th Surface Finishing Society of Japan, (1991) 163.
- Y. Sato, T. Osawa, K. Kaieda, K. Kobayakawa, Cyanide-free electroless gold plating from a bath containing disulfitoaurate and thiourea or its derivatives, Plat. Surf. Finish., 81 (1994) 74.
- A. Sullivan, P. A. Kohl, The autocatalytic deposition of gold in nonalkaline, gold thiosulfate electroless bath, J. Electrochem. Soc., 142 (1995) 2250. https://doi.org/10.1149/1.2044282
- S. Dimitrijevic, M. R. Vujasinovic, V. Trujic, Non-cyanide electrolytes for gold plating - A review, J. Electrochem. Sci., 8 (2013) 6620 - 6646.
- J. Han, D. Kim, Deposition behavior of cyanide-free electroless Au plating solution using thiomalic acid as complexing agent and aminoethanethiol as reducing agent and characteristics of plated Au film, J. Surf. Sci. Eng. 55(2), (2022) 102-119.
- J. Han, D. Kim, Analysis of cyanide free electroless Au plating solution by capillary elecrophoresis, J. Surf. Sci. Eng. 55 (2022) 120-132.
- J. Han, J. Lee, N. V. Phuong, D. Kim, A Newly Developed Non-Cyanide Electroless Gold Plating Method Using Thiomalic Acid as a Complexing Agent and 2-Aminoethanethiol as a Reducing Agent, Corros. Sci. Tech., 21 (2022) 89-99.
- D. Kim, Comparison of Deposition Behavior and Properties of Cyanide-free Electroless Au Plating on Various Underlayer Electroless Ni-P films, J. Surf. Sci. Eng. 55 (2022) 202-214.
- K. Nishiyama, H. Watanabe, The type and application of electroless gold plating, J. Surf. Finish. Soc. Jpn., 48 (1997) 393. https://doi.org/10.4139/sfj.48.393
- T. Yamamoto, H. Watanabe, K. Izawa, H. Honma, Effect of electroless nickel/displacement gold plating process on strength of solder Joint, J. Jpn. Inst. Electron. Packag., 6 (2003) 339-344. https://doi.org/10.5104/jiep.6.339
- A. Chinda, N. Miyamoto, O. Yoshioka, Gold plating thickness and soldering reliability of solder balls for electroless gold plated TAB tape carrier, J. Jpn. Inst. Electron. Packag., 3 (2000) 308-314. https://doi.org/10.5104/jiep.3.308
- F. Taniguchi, F. Ando, A. Takashima, Thermal fatigue and mechanical reliability of FBGA solder joints, J. Jpn. Inst. Electron. Packag., 4 (2001) 56-62. https://doi.org/10.5104/jiep.4.56
- H. Ohata, Y. Momokawa, E. Kouno, M. Tsunemasu, Y. Tanaka, The destruction mode and the life cycle times of the chip size package mounted on the circuit board by the bending test, J. Jpn. Inst. Electron. Packag., 4 (2001) 519-522. https://doi.org/10.5104/jiep.4.519
- H. Matsuki, H. Ibuka, H. Saka, A TEM observation of solder joints of an electronic device, J. Jpn, Inst. Metals, 64 (2000) 213-217. https://doi.org/10.2320/jinstmet1952.64.3_213
- Y. Kariya, K. Nakamura, M. Ohtsuka, H. Tanaka, 6th Symposium on Microjoining and Assembly Technology in Electronics,(2000) 415.
- T. Sugizaki, K. Tajima, T. Sasaki, H. Nakao, Y. Fukuda, T. Kimura, Effect of electroless nickel/immersion gold finishing on BGA solder joints, J. Japan Inst. Electron. Packag., 4 (2001) 124-127. https://doi.org/10.5104/jiep.4.124
- Electroplating Research Society, Eds., Environmental Coordinated Plating Technology, Daily Industrial Newspaper, (2006) 62.
- H. K. Lee, S. H. Son, H. Y. Lee, J. M. Jeon, A study on the ENIG surface finish process and its properties, J. Kor. Inst. Surf. Eng., 40 (2007) 32-38. https://doi.org/10.5695/JKISE.2007.40.1.032
- T. Laurila, V. Vuorinen, Combined thermodynamic-kinetic analysis of the interfacial reactions between Ni metallization and various lead-free solders, Materials 2 (2009) 1796-1834. https://doi.org/10.3390/ma2041796
- E. Bradley, K. Banerji, Effect of PCB finish on the reliability and wettability of ballgrid array packages. In Proc. 45th Electronic Components and Technology Conference, Las Vegas, NV, USA, May 21-24 (1995) 1028-1038.