Journal of information and communication convergence engineering

The Korea Institute of Information and Commucation Engineering (한국정보통신학회)
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Investigation into Electrical Characteristics of Logic Circuit Consisting of Modularized Monolithic 3D Inverter Unit Cell

  • Lee, Geun Jae (ICT & Robotics Engineering and IITC, Hankyong National University) ;
  • Ahn, Tae Jun (Department of Electrical, Electronic, and Control Engineering, Hankyong National University) ;
  • Lim, Sung Kyu (School of Electrical and Computer Engineering, Georgia Institute of Technology) ;
  • Yu, Yun Seop (ICT & Robotics Engineering and IITC, Hankyong National University)
  • Received : 2021.11.05
  • Accepted : 2021.12.09
  • Published : 2022.06.30
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Abstract

Monolithic three-dimensional (M3D) logics such as M3D-NAND, M3D-NOR, M3D-buffer, M3D 2×1 multiplexer, and M3D D flip-flop, consisting of modularized M3D inverters (M3D-INVs), have been proposed. In the previous M3D logic, each M3D logic had to be designed separately for a standard cell library. The proposed M3D logic is designed by placing modularized M3D-INVs and connecting interconnects such as metal lines or monolithic inter-tier-vias between M3D-INVs. The electrical characteristics of the previous and proposed M3D logics were simulated using the technology computer-aided design and Simulation Program with Integrated Circuit Emphasis with the extracted parameters of the previously developed LETI-UTSOI MOSFET model for n- and p-type MOSFETs and the extracted external capacitances. The area, propagation delay, falling/rising times, and dynamic power consumption of the proposed M3D logic are lower than those of previous versions. Despite the larger space and lower performance of the proposed M3D logic in comparison to the previous versions, it can be easily designed with a single modularized M3D-INV and without having to design all layouts of the logic gates separately.

Keywords

Acknowledgement

This research was supported by the Basic Science Research Program through the NRF of Korea, funded by the Ministry of Education (NRF-2019R1A2C1085295). This study was also supported by the IDEC (EDA tool).

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