Nuclear Engineering and Technology

Korean Nuclear Society (한국원자력학회)
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Fabrication of diamond/W-Cu functionally graded material by microwave sintering

  • Wei, Chenlong (School of Materials Science and Engineering, Hefei University of Technology) ;
  • Cheng, Jigui (School of Materials Science and Engineering, Hefei University of Technology) ;
  • Zhang, Mei (School of Materials Science and Engineering, Hefei University of Technology) ;
  • Zhou, Rui (School of Materials Science and Engineering, Hefei University of Technology) ;
  • Wei, Bangzheng (School of Materials Science and Engineering, Hefei University of Technology) ;
  • Yu, Xinxi (School of Materials Science and Engineering, Hefei University of Technology) ;
  • Luo, Laima (School of Materials Science and Engineering, Hefei University of Technology) ;
  • Chen, Pengqi (School of Materials Science and Engineering, Hefei University of Technology)
  • Received : 2020.11.18
  • Accepted : 2021.08.30
  • Published : 2022.03.25
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Abstract

A four-layered W/Cu functionally graded material (FGM) (W90% + Cu10%/W80% + Cu20%/W70% + Cu30%/W60% + Cu40%, wt.% fraction) and a four-layered diamond/W-Cu FGM (W90% + Cu10%/W80% + Cu20%/W70% + Cu30%/W55% + Cu40% + diamond5%, wt.% fraction) were fabricated by microwave sintering. The thermal conductivity and thermal shock resistance of diamond/W-Cu FGM and W-Cu FGM were investigated. The morphologies of the diamond particles and different FGMs were analyzed using AFM, SEM, EDS, and TEM. The results show that a 200 nm rough tungsten coating was formed on the surface of the diamond. The density of the tungsten-coated diamond/W-Cu FGM, obtained by microwave sintering at 1200 ℃ for 30 min, was 94.66%. The thermal conductivity of the fourlayered diamond/W-Cu FGM was 220 W·m-1·K-1, which is higher than that of the four-layered W/Cu FGM (209 W m-1 K-1). This indicates that adding an appropriate amount of tungsten-coated diamond to the high Cu layer W/Cu FGM improves the thermal conductivity of the composite. The diamond/W-Cu FGM sintered at 1200 ℃ for 10 min exhibited better thermal shock resistance than diamond/W-Cu FGM sintered at 1100 ℃ for 10 min.

Keywords

Acknowledgement

This work was financially supported by the National Natural Science Foundation of China (51674095, 52004079).

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