반도체디스플레이기술학회지 (Journal of the Semiconductor & Display Technology)

한국반도체디스플레이기술학회 (The Korean Society Of Semiconductor & Display Technology)
권호 표지

Wafer Hybrid Bonding을 위한 Upper Wafer Handling 모듈 설계 및 제어

Upper Wafer Handling Module Design and Control for Wafer Hybrid Bonding

  • 투고 : 2022.03.12
  • 심사 : 2022.03.25
  • 발행 : 2022.03.31
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초록

After introducing Hybrid Bonding technology into image sensors using stacked sensors and image processors, large quantity production became possible. As a result, it is currently used in most of the CMOS image market in smartphones and other image-based devices worldwide, and almost all stacked CIS manufacturing sites have focused on miniaturization using hybrid bonding. In this study, an upper wafer handling module for Wafer to Wafer Hybrid Bonding developed to increase the alignment and precision between wafers when wafer bonding. The module was divided two parts to reduce error of both the alignment and degree of precision during wafer bonding. Wafer handling module developed both new Tip/Tilt system controlling θx,θy of upper wafer and striker to push upper wafer. Based on this, it was confirmed through the stability evaluation that the upper wafer handling module can be controlled without any problem during W2W hybrid bonding.

키워드

과제정보

본 연구는 2021년도 중소벤처기업부의 기술개발사업 지원에 의한 연구임 [S3143469-반도체 전공정 검사/계측/고진공 장비를 위한 초정밀 모션 스테이지 표준 플랫폼 개발].

참고문헌

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