Acknowledgement
본 연구는 정부(교육부)의 재원으로 한국연구재단(No.2018 R1D1A3B07045339)과 중소벤처기업부의 기술개발사업(S3157893)의 지원에 의한 연구임.
References
- Leong, Y.W, Yamaguchi, S., Mizoguchi, M., Hamada, H., Ishiaku, U.S. and Tsujii, T., "The effect of molding conditions on mechanical and morphological properties at the interface of film insert injection molded polypropylene-film/ polypropylene matrix", Polym. Eng. Sci., Vol. 44, No. 12, pp. 2327-2334. 2004. https://doi.org/10.1002/pen.20260
- Oulu, P.N., Kempele, S. and Kempele, P.R., "Multilayer structure for accommodating electronics and related method of manufacture", Tacto Tek Oy, US Patent, No. 9724869B2, 2017.
- Gimenez, E., Lagaron, J.M., Cabedo, L., Gavara, R. and Saura, J.J., "Study of the thermoformability of ethylene-vinyl alcohol copolymer based barrier blends of interest in food packaging applications", J. of Appl. Poly. Sci., Vol. 96, pp. 3851-3855, 2004.
- Gimenez, E., Lagaron, J.M., Maspoch, M.L., Cabedo, L. and Saura, J.J., "Uniaxial tensile behavior and thermoforming characteristics of high barrier EVOH-based blends of interest in food packaging", Poly. Eng. & Sci., Vo. 44, pp. 598-608, 2004. https://doi.org/10.1002/pen.20054
- Poller, S. and Michaeli, W., "Film temperatures determine the wall thickness of thermoformed parts", SPE ANTEC, Vol. 38, pp. 104-108, 1992.
- Aroujallan, A., Ngadi, M.O. and Emond, J.P., "Wall thickness distribution in plug-assist vacuum formed strawberry containers", Poly. Eng. & Sci., Vo. 37, pp. 178-182, 1997. https://doi.org/10.1002/pen.11659
- Chen, S.-C., Huang, S.-T., Lin, M.-C. and Chien, R.-D., "Study on the thermoforming of PC films used for in-mold decoration", Int. Comm. in Heat and Mass transfer, Vol.35, pp. 967-973, 2008. https://doi.org/10.1016/j.icheatmasstransfer.2008.04.008
- Kim, G., Lee, K. and Kang, S., "Prediction of the film thickness distribution and pattern change during film insert thermoforming", Poly. Eng. & Sci., Vol.49, pp. 2195-2203, 2009. https://doi.org/10.1002/pen.21467
- Lee, J.K. , Virkler, T.L. and Scott, C.E., "Effects of rheological properties and processing parameters on ABS thermoforming", Poly. Eng. & Sci., Vol.41, pp. 240-261, 2001. https://doi.org/10.1002/pen.10725
- Lee, J.K. , Virkler, T.L. and Scott, C.E., "Influence of initial sheet temperature on ABS thermoforming", Poly. Eng. & Sci., Vol.41, pp. 1830-1844, 2001. https://doi.org/10.1002/pen.10880
- Yoo, Y.G. and Lee, H.S., "Effects of processing conditions on thickness distribution for a laminated film during vacuum-assisted thermoforming", Trans. Mater. Process., Vol.20, pp. 250-256, 2011. https://doi.org/10.5228/KSTP.2011.20.3.250
- Yoo, Y.G. and Lee, H.S., "Numerical and experimental analysis of laminated-film thickness variation in vacuum-assisted thermoforming", Trans. Mater. Process., Vol.20, pp. 250-256, 2011. https://doi.org/10.5228/KSTP.2011.20.3.250
- Seong, G.S. and Lee, H.S., "A study on the thickness distribution and pattern deformation of films in vacuum-assisted thermoforming", J. Korea Society of Die & Mold Engineering, Vol. 12, No. 2, pp. 5-10, 2018.
- Bernstein, B, Kearsley, E.A. and Zapas, L.J., "A study of stress relaxation with finite strain", Trans. Soc. Rheol., Vol. 7, pp. 391-410, 1963. https://doi.org/10.1122/1.548963
- Wagner, M.H., "Analysis of time-dependent non-linear stress-growth data for shear and elongational flow of a low-density branched polyethylene melt", Rheol. Acta., Vol. 18, pp. 33-50, 1979. https://doi.org/10.1007/BF01515686
- Acuuform, Computer simulations of thermoforming and blowing molding, http://www.t-sim.com/index.html, 2005.
- Phadke, M. S., Quality Engineering using Robust Design, AT&T Bell Lab., Prentice Hall, 1992.