Textile Science and Engineering (한국섬유공학회지)

The Korean Fiber Society (한국섬유공학회)
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Morphological Characteristics According to the 3D Printing Extrusion Temperature of TPU Filaments for Different Hardnesses

경도별 TPU 필라멘트의 3D 프린팅 압출 온도 조건에 따른 모폴로지 특성

  • Jung, Imjoo (Department of Fashion and Textiles, Dong-A University) ;
  • Shin, Eunjoo (Department of Organic Materials and Polymer Engineering, Dong-A University) ;
  • Lee, Sunhee (Department of Fashion and Textiles, Dong-A University)
  • 정임주 (동아대학교 의상섬유학과) ;
  • 신은주 (동아대학교 유기재료고분자공학과) ;
  • 이선희 (동아대학교 의상섬유학과)
  • Received : 2022.01.12
  • Accepted : 2022.02.11
  • Published : 2022.02.28
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Abstract

Thermoplastic polyurethane (TPU) is used in various fields because of its excellent elasticity, flexibility, mechanical strength, and shock absorption. In particular, in the fused deposition modeling (FDM), in which layers are extruded by heating and melting thermoplastic materials through a nozzle, the adhesion and mechanical properties of the output are affected according to the nozzle temperature. In this study, six types of TPU filaments with various hardnesses (65A, 75A, 80A, and 85A) were manufactured through commercial chip and synthesis (comp) and extruded under five nozzle temperature conditions (190℃, 200℃, 210℃, 220℃, and 230℃). Then, the most suitable nozzle temperature for the filament was confirmed, and the re-entrant pattern was printed. Extruded filaments and printed re-entrant patterns were analyzed through morphology analysis. Finally, the tensile properties of the two samples of the optimal printed condition for FDM 3D printing were examined. Consequently, the optimal nozzle temperature of each TPU filament was confirmed as 190℃ for Chip-65A, 210℃ for Chip-75A, 210℃ for Chip-80A, 200℃ for Chip-85A, 210℃ for Comp-75A, and 200℃ for Comp-85A. Through printing re-entrant patterns and morphologies, Chip-75A and Comp-75A were considered to be the most suitable for 3D printing. The tensile properties showed that Chip-75A was more flexible than Comp-75A.

Keywords

Acknowledgement

이 성과는 정부(과학기술정보통신부)의 재원으로 한국연구재단의 지원을 받아 수행된 연구임 (NRF-2021R1A4A1022059).

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