Improvement of CMP and Cleaning Process of Large Size OLED LTPS Thin Film Using Oscar Type Polisher

Oscar형 연마기를 이용한 대면적 OLED용 LTPS 박막의 CMP 처리 및 세정 공정 개선

  • Received : 2022.11.17
  • Accepted : 2022.12.12
  • Published : 2022.12.31

Abstract

We evaluated and developed a 6th generation large-size polisher in the type of face-up and Oscar. We removed the hillocks of the low temperature poly-silicon (LTPS) thin film with this polisher. The surface roughness of LTPS was lowered from 7.9 nm to 0.6 nm after CMP(chemical mechanical polishing). The thickness of the LTPS is measured through reflectance in real time during polishing, and the polishing process is completed according to this thickness. The within glass non-uniformity (WIGNU) was 6.2% and the glass-to-glass non-uniformity (GTGNU) was 2.5%, targeting the LTPS thickness of 400Å. In addition, the residual slurry after the CMP process was removed through the Core Flow PVA Brush and alkaline chemical.

Keywords

Acknowledgement

본 연구는 2021년도 중소벤처기업부의 창업성장기술개발사업 지원에 의한 연구임 [S3139319].

References

  1. Lee, Meng-Ting, et al. "24-5L: Late-News Paper: Ultra Durable and Foldable AMOLED Display Capable of Withstanding One Million Folding Cycles." SID Symposium Digest of Technical Papers. Vol. 47. No. 1. 2016. https://doi.org/10.1002/sdtp.10656
  2. J. Park, Y. -H. Hwang, J. Oh, Y. Song, J. -E. Park and D.-K. Jeong, "A Mutual Capacitance Touch Readout IC With 64% Reduced-Power Adiabatic Driving Over Heavily Coupled Touch Screen," in IEEE Journal of Solid-State Circuits, vol. 54, no. 6, pp. 1694-1704, June 2019, doi: 10.1109/JSSC.2019.2898344.
  3. Lee, M. Y., Kang, H. G., Kanemoto, M., Paik, U., & Park, J. G. (2007). Effect of alkaline agent in colloidal silica slurry for polycrystalline silicon chemical mechanical polishing. Japanese Journal of Applied Physics, 46(8R), 5089. https://doi.org/10.1143/JJAP.46.5089
  4. C. -L. Wang et al., "High-Performance Polycrystalline-Silicon Nanowire Thin-Film Transistors With Location-Controlled Grain Boundary via Excimer Laser Crystallization," in IEEE Electron Device Letters, vol. 33, no. 11, pp. 1562-1564, Nov. 2012, doi: 10.1109/LED.2012.2211857.
  5. R. E. Proano, R. S. Misage and D. G. Ast, "Development and electrical properties of undoped polycrystalline silicon thin-film transistors," in IEEE Transactions on Electron Devices, vol. 36, no. 9, pp. 1915-1922, Sept. 1989, doi: 10.1109/16.34270.
  6. D. K. Fork, G. B. Anderson, J. B. Boyce, R. I. Johnson, and P. Mei, "Capillary waves in pulsed excimer laser crystallized amorphous sil- icon," Appl. Phys. Lett., vol. 68, no. 15, pp. 2138-2140, Apr. 1996. doi: 10.1063/1.115610.
  7. T. Goto et al., "LTPS Thin-Film Transistors Fabricated Using New Selective Laser Annealing System," in IEEE Transactions on Electron Devices, vol. 65, no. 8, pp. 3250-3256, Aug. 2018, doi: 10.1109/TED.2018.2846412.
  8. Choi, YH., Ryu, HY. "Formation of a Polycrystalline Silicon Thin Film by Using Blue Laser Diode Annealing." J. Korean Phys. Soc. 72, 939-942 (2018). https://doi.org/10.3938/jkps.72.939
  9. Y. H. Jung, S. Hong, S. Lee, S. Jin, T.-W. Kim, Y. Chang, J. Jang, "Sequential lateral crystallization of amorphous silicon on glass by blue laser annealing for high mobility thin-film transistors," Thin Solid Films 2019, 681, 93. https://doi.org/10.1016/j.tsf.2019.04.023.
  10. M. M. Billah et al., "Effect of Grain Boundary Protrusion on Electrical Performance of Low Temperature Polycrystalline Silicon Thin Film Transistors," in IEEE Journal of the Electron Devices Society, vol. 7, pp. 503-511, 2019, doi: 10.1109/JEDS.2019.2911088.
  11. Yuh, M., Jang, S., Kim, H. et al. "Development of green CMP by slurry reduction through controlling platen coolant temperature." Int. J. of Precis. Eng. and Manuf.-Green Tech. 2, 339-344 (2015). https://doi.org/10.1007/s40684-015-0041-8
  12. H. S. Lee. (2014). Kinematic Analysis on OSCAR-Type Polisher for CMP of Large-Sized Substrate. Korean Trybology Society, (), 172-173.
  13. Philipossian, Ara, and Lateef Mustapha. "Effect of mechanical properties of PVA brush rollers on frictional forces during post-CMP scrubbing." Journal of the Electrochemical Society 151.9 (2004): G632. https://doi.org/10.1149/1.1782092
  14. Sahir, S., Cho, H. W., Kim, T. G., Hamada, S., Yerriboina, N. P., & Park, J. G. (2022). "Study on PVA Brush Loading and Conditioning during Shallow Trench Isolation Post-CMP Cleaning Process." ECS Journal of Solid State Science and Technology, 11(2), 024004. https://doi.org/10.1149/2162-8777/ac5166