Acknowledgement
본 논문은 과학기술정보통신부의 재원으로 정보통신기술진흥센터[과제번호: B0132-15-1006, Development of High Efficiency GaN-based Key Components and Modules for Base and Mobile Stations], 정보통신기획평가원[과제번호: 2019-0-00068, 미세공정 화합물 반도체 기반 밀리미터파 대역 5G 부품기술 개발] 지원을 받아 수행된 연구임.
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