반도체 생산라인에서 SA를 이용한 최적 WIP수준과 버퍼사이즈 결정

Determining Optimal WIP Level and Buffer Size Using Simulated Annealing in Semiconductor Production Line

The domestic semiconductor industry can produce various products that will satisfy customer needs by diversifying assembly parts and increasing compatibility between them. It is necessary to improve the production line as a method to reduce the work-in-process inventory (WIP) in the assembly line, the idle time of the worker, and the idle time of the process. The improvement of the production line is to balance the capabilities of each process as a whole, and to determine the timing of product input or the order of the work process so that the time required between each process is balanced. The purpose of this study is to find the optimal WIP and buffer size through SA (Simulated Annealing) that minimizes lead time while matching the number of two parts in a parallel assembly line with bottleneck process. The WIP level and buffer size obtained by the SA algorithm were applied to the CONWIP and DBR systems, which are the existing production systems, and the simulation was performed by applying them to the new hybrid production system. Here, the Hybrid method is a combination of CONWIP and DBR methods, and it is a production system created by setting new rules. As a result of the Simulation, the result values were derived based on three criteria: lead time, production volume, and work-in-process inventory. Finally, the effect of the hybrid production method was verified through comparative analysis of the result values.