마이크로전자및패키징학회지 (Journal of the Microelectronics and Packaging Society)

  • 제28권2호
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  • Pages.1-12
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  • 2021
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  • 1226-9360(pISSN)
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  • 2287-7525(eISSN)
한국마이크로전자및패키징학회 (The Korean Microelectronics and Packaging Society)
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3차원 인쇄기술을 이용한 전자소자 연구 동향

3D Printed Electronics Research Trend

  • 박예슬 (서울대학교 재료공학부) ;
  • 이주용 (서울대학교 재료공학부) ;
  • 강승균 (서울대학교 재료공학부)
  • Park, Yea-Seol (Department of Materials Science and Engineering, Seoul National University) ;
  • Lee Ju-Yong (Department of Materials Science and Engineering, Seoul National University) ;
  • Kang, Seung-Kyun (Department of Materials Science and Engineering, Seoul National University)
  • 투고 : 2021.05.27
  • 심사 : 2021.06.07
  • 발행 : 2021.06.30
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⟨ 이전 논문 다음 논문 ⟩

초록

3차원 인쇄 기술은 제품의 설계를 3차원으로 하여 조립없이 제품의 생산까지의 시간을 획기적으로 줄이고 복잡한 구조도 구현할 수 있어 미래의 기술로 각광받고 있다. 본 논문은 3차원 인쇄기술을 이용한 전자소자에 대한 최근 연구동향을 알아보면서 구성품, 전원공급장치와 회로에서의 연결과 3차원 인쇄기술 PCB의 응용한 연구논문들을 소개하고 있다. 3차원 인쇄기술로 제작한 전자소자는 원스톱으로 전자소자, 솔더링(soldering), 스태킹(stacking), 회로의 봉지막(encapsulation)까지 제작함으로써 생산설비의 단순화와 전자기기를 개인 맞춤형을 할 수 있는 가능성을 보여주었다.

3D printing, which designs product in three dimensions, draws attention as a technology that will lead the future for it dramatically shortens time for production without assembly, no matter how complex the structure is. The paper studies the latest researches of 3D-printed electronics and introduces papers studied electronics components, power supply, circuit interconnection and 3D-printed PCBs' applications. 3D-printed electronics showed possibility to simplify facilities and personalize electric devices by providing one-stop printing process of electronic components, soldering, stacking, and even encapsulation.

키워드

과제정보

이 성과는 정부(과학기술정보통신부)의 재원으로 한국연구재단의 지원을 받아 수행된 연구임(NRF-2019R1C1C1004232).

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