References
- P. S. Ho and T. Kwok, "Electromigration in metals", Rep. Prog. Phys., 52, 301 (1989). https://doi.org/10.1088/0034-4885/52/3/002
- W. Steinhogl, G. Schindler, G. Steinlesberger and M. Engelhardt, "Size-dependent resistivity of metallic wires in the mesoscopic range", Phys. Pev. B 66, 075414 (2002).
- Z. Yao, C. L. Kane and C. Dekker, "High-field electrical transport in single-wall carbon nanotubes", Phys. Rev. Lett. 84, 2941 (2000). https://doi.org/10.1103/PhysRevLett.84.2941
- R. Murali, Y. Yang, K. Brenner, T. Beck and J. D. Meindl, "Breakdown current density of graphene nanoribbons", Appl. Phys. Lett. 94, 2431143 (2009).
- Z. Yao, C. L. Kane and C. Dekker, "High-field electrical transport in single-wall carbon nanotubes", Phys. Rev. Lett. 84, 2941 (2000). https://doi.org/10.1103/PhysRevLett.84.2941
- C. Subramaniam, T. Yamada, K. Kobashi, A. Sekiguchi, D. N. Futaba, M. Yumura and K. Hata, "One hundred folds increase in current carrying capacity in a carbon nanotube-copper composite", Nat. Comm. 4, 2022 (2013). https://doi.org/10.1038/ncomms3022
- H. Rho, M. Park, M. Park, J. Park, J. Han, A. Lee, S. Bae, T.-W. Kim, J.-S. Ha, S. M. Kim, D. S. Lee, and S. H. Lee, "Metal nanofibrils embedded in long free-standing carbon nanotube fibers with a high critical current density", NPG Asia Mater. 10, 146 (2018). https://doi.org/10.1038/s41427-018-0028-3
- S. J. Kim, D. H. Shin, Y. S. Choi, H. Rho, M. Park, B. J. Moon, Y. Kim, S.-K. Lee, D. S. Lee, T.-W. Kim, S. H. Lee, K. S. Kim, B. H. Hong and S. Bae "Ultrastrong Graphene-Copper Core-Shell Wires for High-Performance Electrical Cables", ACS Nano 12, 2803 (2018). https://doi.org/10.1021/acsnano.8b00043
- T. W. Lee and H.-H. Park "The Effect of Graphene on the Electrical Properties of a Stretchable Carbon Electrode", J. Microelectron. Packag. Soc., 21, 77 (2014). https://doi.org/10.6117/kmeps.2014.21.4.077
- S. W. Bang, H. Rho, H. Bae, S.-J. Kang and J.-S. Ha, "Improvement of Electrochemical Reduction Characteristics of Carbon Dioxide at Porous Copper Electrode using Graphene", J. Microelectron. Packag. Soc., 25, 105 (2018) https://doi.org/10.6117/KMEPS.2018.25.4.105
- R. Mehta, S. Chugh, and Z. Chen, "Enhanced Electrical and Thermal Conduction in Graphene-Encapsulated Copper Nanowires", Nano Lett. 15, 2024 (2015). https://doi.org/10.1021/nl504889t
- I. Calizo, I. Bejenari, M. Rahman, G. Liu and A. A. Balandin, Ultraviolet Raman microscopy of single and multilayer graphene", J. Appl. Phys. 106, 043509 (2009). https://doi.org/10.1063/1.3197065
- S. Kasap and P. Capper, "Springer Handbook of Electronic and Photonic Materials", Springer International Publishing (2017).
- J. Cho and C. V. Thompson, Grain size dependence of electromigration-induced failures in narrow interconnects", Appl. Phys. Lett. 54, 2577 (1989). https://doi.org/10.1063/1.101054