과제정보
이 연구는 한국연구재단 이공학 개인기초 연구사업(기본연구)의 지원(과제명: (201800050004)반도체 패키지용 PCB의 warpage 불량 감소 solution개발)으로 수행되었습니다.
참고문헌
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- MSC/MARC 2021 manual.