DOI QR코드

DOI QR Code

에어로졸 데포지션 공정으로 제작된 BaTiO3 필름 성장에 출발 원료가 미치는 영향

Effect of Starting Powder on the Growth of BaTiO3 Film Prepared by Aerosol Deposition Process

  • 조명연 (광운대학교 전자재료공학과) ;
  • 김익수 (광운대학교 전자재료공학과) ;
  • 이동원 (광운대학교 전자재료공학과) ;
  • 구상모 (광운대학교 전자재료공학과) ;
  • 오종민 (광운대학교 전자재료공학과)
  • Cho, Myung-Yeon (Department of Electronic Materials Engineering, Kwangwoon University) ;
  • Kim, Ik-Soo (Department of Electronic Materials Engineering, Kwangwoon University) ;
  • Lee, Dong-Won (Department of Electronic Materials Engineering, Kwangwoon University) ;
  • Koo, Sang-Mo (Department of Electronic Materials Engineering, Kwangwoon University) ;
  • Oh, Jong-Min (Department of Electronic Materials Engineering, Kwangwoon University)
  • 투고 : 2020.01.20
  • 심사 : 2020.02.15
  • 발행 : 2020.05.01

초록

Four types of BaTiO3 powders are prepared and successfully deposited on glass and Pt/Si substrates using the aerosol deposition process. Particles with sizes of 0.45 ㎛ and 0.3 ㎛ are selected as the starting powder, while those powders are treated using a different milling method. The jet-milled and ball-milled powders not only showed a smaller particle-size distribution, but compared with the non-milled powder, it also had a higher deposition rate using the uniformly generated aerosol. Although the films deposited using particles with size 0.45 ㎛ exhibited some craters on the surface, significantly flat film surfaces were obtained. However, particles with size 0.3 ㎛ create a slightly rough film surface, but the dielectric constant was greater than in the case involving particles with size 0.45 ㎛. Consequently, a suitably large particle size significantly influences the deposition rate and improvement in the surface roughness, and a uniform particle size distribution appears to contribute to an improved dielectric constant. Therefore, it is believed that the dielectric properties along with the growth characteristics can be enhanced by limiting particle size and shape.

키워드

참고문헌

  1. J. Akedo, J. Am. Ceram. Soc., 89, 1834 (2006). [DOI: http://doi.org/10.1111/j.1551-2916.2006.01030.x]
  2. J. Akedo, J. Therm. Spray Technol., 17, 181 (2008). [DOI: http://doi.org/10.1007/s11666-008-9163-7]
  3. Y. Imanaka, N. Hayashi, M. Takenouchi, and J. Akedo, J. Eur. Ceram. Soc., 27, 2789 (2007). [DOI: https://doi.org/10.1016/j.jeurceramsoc.2006.11.055]
  4. J. M. Oh and S. M. Nam, Jpn. J. Appl. Phys., 48, 09KA07 (2009). [DOI: https://doi.org/10.1143/jjap.48.09ka07]
  5. J. Ryu, D. S. Park, B. D. Hahn, J. J. Choi, W. H. Yoon, K. Y. Kim, and H. S. Yun, Appl. Catal., B, 83, 1 (2008). [DOI: https://doi.org/10.1016/j.apcatb.2008.01.020]
  6. T. Fujihara, M. Tsukamoto, N. Abe, S. Miyake, T. Ohji, and J. Akedo, Vacuum, 73, 629 (2004). [DOI: https://doi.org/10.1016/j.vacuum.2003.12.082]
  7. M. Y. Cho, D. W. Lee, P. J. Ko, S. M. Koo, J. S. Kim, Y. K. Choi, and J. M. Oh, Electron. Mater. Lett., 15, 227 (2019). [DOI: https://doi.org/10.1007/s13391-018-00111-w]
  8. M. Y. Cho, S. J. Park, S. M. Kim, D. W. Lee, H. K. Kim, S. M. Koo, K. S. Moon, and J. M. Oh, Ceram. Int., 44, 16548 (2018). [DOI: https://doi.org/10.1016/j.ceramint.2018.06.076]
  9. J. J. Park, D. Y. Kim, J. G. Lee, D. Kim, J. H. Oh, T. Y. Seong, M.F.A.M. Van Hest, and S. S. Yoon, J. Am. Ceram. Soc., 96, 1596 (2013). [DOI: https://doi.org/10.1111/jace.12164]
  10. I. S. Kim, P. J. Ko, M. Y. Cho, H. K. Kim, D. W. Lee, S. M. Koo, D. Lee, C. Park, and J. M. Oh, Ceram. Int., 45, 20634 (2019). [DOI: https://doi.org/10.1016/j.ceramint.2019.07.046]
  11. M. Y. Cho, D. W. Lee, I. S. Kim, W. J. Kim, S. M. Koo, D. Lee, Y. H. Kim, and J. M. Oh, Ceram. Int., 45, 6702 (2019). [DOI: https://doi.org/10.1016/j.ceramint.2018.12.159]
  12. D. W. Lee, M. C. Shin, Y. N. Kim, and J. M. Oh, Ceram. Int., 43, 1044 (2017). [DOI: https://doi.org/10.1016/j.ceramint.2016.10.037]
  13. J. G. Liang, E. S. Kim, C. Wang, M. Y. Cho, J. M. Oh, and N. Y. Kim, Sens. Actuators, B, 265, 632 (2018). [DOI: https://doi.org/10.1016/j.snb.2018.03.093]
  14. M. Y. Cho, S. Kim, I. K. Kim, E. S. Kim, Z. J. Wang, N. Y. Kim, S. W. Kim, and J. M. Oh, Adv. Funct. Mater., 30, 1907449 (2020). [DOI: https://doi.org/10.1002/adfm.201907449]
  15. D. W. Lee, H. J. Kim, and S. M. Nam, J. Korean Phys. Soc., 57, 1115 (2010). [DOI: https://doi.org/10.3938/jkps.57.1115]
  16. M. Y. Cho, D. W. Lee, I. K. Kim, W. H. Lee, J. W. Yoo, P. J. Ko, S. M. Koo, Y. K. Choi, and J. M. Oh, Jpn. J. Appl. Phys., 57, 11UF05 (2018). [DOI: https://doi.org/10.7567/JJAP.57.11UF05]
  17. J. M. Oh, N. H. Kim, S. C. Choi, and S. M. Nam, Mater. Sci. Eng. B, 161, 80 (2009). [DOI: https://doi.org/10.1016/j.mseb.2009.01.028]