KIPS Transactions on Computer and Communication Systems (정보처리학회논문지:컴퓨터 및 통신 시스템)

Korea Information Processing Society (한국정보처리학회)
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Development of Thermal Image Processing Module Using Common Image Processor

상용 이미지 처리 프로세서를 이용한 열화상 이미지 처리 모듈 개발

  • 한준환 (한화시스템 전자광학연구소) ;
  • 차정우 (한화시스템 전자광학연구소) ;
  • 김보미 (한화시스템 전자광학연구소) ;
  • 임재성 (아주대학교 소프트웨어학과)
  • Received : 2019.09.27
  • Accepted : 2019.11.27
  • Published : 2020.01.31
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Abstract

The thermal image device support image to detect infrared light from the object without light. It can use not only defence-related industry, but also civilian industry. This paper presents a new thermal image processing module using common image processor. The proposed module shows 10~20% performance improvement with normal mode and 50% performance improvement with sleep mode compared with the previously thermal image module based FPGA. and it guarantees high scalability according to modular system. In addition, the proposed module improves modulation and reuse, so it expect to have reduction of development period, low development cost. various application. In addition, it expect to have satisfaction of customer requirements, development design, development period, release date of product.

열화상 장비는 빛이 없는 암흑 상태에서도 물체에서 발산하는 적외선을 탐지하여 이를 영상으로 제공하는 장비이다. 이러한 장점으로 기존 활용되던 군사 분야와 더불어 자동차 및 감시시스템 등 다양한 민수 분야로 활용분야가 넓어지고 있다. 본 논문에서는 상용 이미지 처리 프로세서를 이용한 열화상 이미지 처리 모듈을 제안한다. 제안한 모듈은 기존 FPGA 기반 열화상 이미지 모듈대비 약 10~20%의 성능향상을 보이며, 대기모드를 포함하면 최대 50%까지 성능향상을 보인다. 그리고 시스템 모듈화를 통한 높은 확장성을 보장한다. 뿐만 아니라 제안한 모듈은 기존의 FPGA 기반 모듈의 단점인 낮은 확장성과 재활용성을 보완함으로써 개발 기간 및 비용 단축, 다양한 응용이 가능하다. 따라서, 이러한 장점으로 다양한 고객의 요구사항 만족, 제품 설계 및 개발 일정 단축 등 다양한 이점을 얻을 것으로 기대한다.

Keywords

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