한국기계가공학회지 (Journal of the Korean Society of Manufacturing Process Engineers)

한국기계가공학회 (The Korean Society of Manufacturing Process Engineers)
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나노스케일 절삭가공에서의 비절삭저항 변화 및 원인 분석

Analysis of Variation of Specific Cutting Resistance in Nanoscale Cutting

  • 권예필 (울산대학교 첨단소재공학부) ;
  • 김시훈 (울산대학교 첨단소재공학부) ;
  • 전은채 (울산대학교 첨단소재공학부)
  • Kwon, Ye-Pil (School of Materials Science and Engineering, University of Ulsan) ;
  • Kim, Si-Hoon (School of Materials Science and Engineering, University of Ulsan) ;
  • Jeon, Eun-chae (School of Materials Science and Engineering, University of Ulsan)
  • 투고 : 2020.05.31
  • 심사 : 2020.08.18
  • 발행 : 2020.11.30
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초록

In general, lithography techniques are applied when machining single-crystal silicon in nanoscale applications; however, these techniques involve low degrees of freedom for the vertical shapes. By applying mechanical techniques to machine silicon, nanopatterns having various types of vertical shapes can be manufactured. In this study, we determined the ductile-brittle machining transition point and analyzed the- variation of the specific cutting resistance within the ductile machining region in nanoscale applications. When brittle fracture occurred during the nanoscale cutting, the depth of cut and cutting force increased and decreased rapidly, respectively. The first point of rapid increase in the depth of cut was defined as the ductile-brittle machining point. Subsequently, the shape of the machining tool was observed using a scanning electron microscope to calibrate the machining area, considering the tip blunting. The specific cutting resistance decreased continuously and converged to a certain value during the nanoscale cutting. The decrease and convergence in the value can be attributed to the decrease in the ratio of the arc length to the area of the machining tool and silicon.

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참고문헌

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