Journal of Applied Reliability (한국신뢰성학회지:신뢰성응용연구)
- Volume 19 Issue 4
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- Pages.404-412
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- 2019
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- 1738-9895(pISSN)
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- 2733-8320(eISSN)
DOI QR Code
A Study on the Manufacturing Technique of Composite Heat Dissipation Filler by Sputtering Method
스퍼터링을 이용한 복합소재 방열필러 제조 기술
- Published : 20190000
Abstract
Purpose: This study developed a manufacturing technique for a composite material heat dissipation filler by using the sputtering method, and then verified its application in terms of heat dissipation performance and reliability.Methods: We used the sputtering method to develop a ceramic deposition on the bead surface that was based on the optimal design of the magnetic array of ceramic cathode, followed by manufacturing a composite heat dissipation prototype. The product holder system was developed to improve the efficiency of the ceramic material during the sputtering process.Results: Test results by Laser Flash Apparatus (LFA) indicated that “SR+AIN” had the best thermal conductivity out of four types. Standards and/or user requirements were verified by demonstrating eight types of reliability tests to the Chip-On-Flex (COF) Printed Circuit.Conclusion: The thermal conductivity test revealed 15% improved efficiency. The new composite heat dissipation filler using the sputtering method is expected to improve reliability and reduce the production cost.
Keywords
- Ceramic;
- Composite Heat Dissipation Filler;
- Reliability;
- Chip-on-Flexible Printed Circuit;
- COF;
- Thermal Conductivity;
- Sputtering;
- Laser Flash Apparatus;
- LFA