A Study on the Manufacturing Technique of Composite Heat Dissipation Filler by Sputtering Method

스퍼터링을 이용한 복합소재 방열필러 제조 기술

Purpose: This study developed a manufacturing technique for a composite material heat dissipation filler by using the sputtering method, and then verified its application in terms of heat dissipation performance and reliability.Methods: We used the sputtering method to develop a ceramic deposition on the bead surface that was based on the optimal design of the magnetic array of ceramic cathode, followed by manufacturing a composite heat dissipation prototype. The product holder system was developed to improve the efficiency of the ceramic material during the sputtering process.Results: Test results by Laser Flash Apparatus (LFA) indicated that “SR+AIN” had the best thermal conductivity out of four types. Standards and/or user requirements were verified by demonstrating eight types of reliability tests to the Chip-On-Flex (COF) Printed Circuit.Conclusion: The thermal conductivity test revealed 15% improved efficiency. The new composite heat dissipation filler using the sputtering method is expected to improve reliability and reduce the production cost.