Current Photovoltaic Research

  • 제7권3호
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  • Pages.65-70
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  • 2019
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  • 2288-3274(pISSN)
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  • 2508-125X(eISSN)
한국태양광발전학회 (Korea Photovoltaic Society)
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Half-cell 기반 multi-wires 접합 공정에서 접합 특성에 영향을 주는 요인과 효율의 상관관계 연구

A Study on the Relationship between Factors Affecting Soldering Characteristics and Efficiency of Half-cell Soldering Process with Multi-wires

  • 김재훈 (신재생에너지연구센터, 전자부품연구원) ;
  • 손형진 (신재생에너지연구센터, 전자부품연구원) ;
  • 김성현 (신재생에너지연구센터, 전자부품연구원)
  • Kim, Jae Hun (Renewable Energy Research Center, Korea Electronics Technology Institute) ;
  • Son, Hyoung Jin (Renewable Energy Research Center, Korea Electronics Technology Institute) ;
  • Kim, Sung Hyun (Renewable Energy Research Center, Korea Electronics Technology Institute)
  • 투고 : 2019.07.23
  • 심사 : 2019.09.18
  • 발행 : 2019.09.30
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초록

As a demand of higher power photovoltaic modules, shingled, multi-busbar, half-cell, and bifacial techniques are developed. Multi-busbar module has advantage for large amount of light havesting. And, half-cell is high power module for reducing resistive losses and higher shade tolerance. Recently, researches on multi-busbar is focused on reliability according to adhesion and intermetallic compound between Sn-Pb solder and Ag electrode. And half-cell module is researched to comparing with full-sized cell module for structure difference. In this study, we investigated the factors affecting to efficiency and adhesion of multi-wires half-cell module according to wire thickness, solder thickness, and flux. The results of solar simulator and peel test was that peel strength and efficiency of soldered cell is not related. But samples with flux including high solid material showed high efficiency. The results of FE-SEM and EDX line scan on cross-section between wire and Ag electrode for different flux showed thickness of solder joint between wire and Ag electrode is increasing through solid material increasing. Flux including high solid material would affect to solder behavior on Ag electrode. Higher solid material occurred lower growth of IMC layer because solder permeate to sider of wire ribbon than Ag electrode. And it increased fill factor for high efficiency. In soldering process, amount of solid material in flux and solder thickness are the factor related with characteristic of soldered photovoltaic cell.

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