Fig. 1. The Computational Fluid Dynamics(CFD) simulation model. A) A DTRM on two cold plates, B) A cross section of DTRM
Fig. 2. Components of DTRM in each layer. A) 1st layer, B) 2nd layer, C) 3rd layer, D) 4th layer
Fig. 3. Temperature distributions inside/outside the DTRM under natural convection(NC, left) and forced convection(FC, right) conditions
Fig. 4. Temperature distributions of the cold plates and A) 3rd layer & B) 4th layer of DTRM under natural convection(NC, left) and forced convection(FC, right) conditions
Fig. 5. Maximum temperatures of the primary chips under natural convection(NC) and forced convection(FC) conditions
Fig. 6. Heat removal rate of coolant/air under natural convection(NC) and forced convection(FC) conditions
Fig. 7. Convergence results of FPGA average temperature with respect to A) the element number and B) iteration number
Table 1. Heat generation rate of the primary heat sources and the applied thermal pad thickness
Table 2. Properties of the materials used in CFD simulations
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