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Analysis on Heat Dissipation Characteristics of a Tile-Type Digital Transmitter/Receiver Module

적층형 디지털송수신모듈의 방열특성 분석

  • Yoon, Kichul (The 3rd Research and Development Institute, Agency for Defense Development) ;
  • Kim, Sangwoon (Mechanical Design Team, Hanwha Systems) ;
  • Heo, Jaehun (Mechanical Design Team, Hanwha Systems) ;
  • Kwak, Nojin (Mechanical Design Team, Hanwha Systems) ;
  • Kim, Chan Hong (The 3rd Research and Development Institute, Agency for Defense Development)
  • 윤기철 (국방과학연구소 제3기술연구본부) ;
  • 김상운 (한화시스템(주) 기계설계팀) ;
  • 허재훈 (한화시스템(주) 기계설계팀) ;
  • 곽노진 (한화시스템(주) 기계설계팀) ;
  • 김찬홍 (국방과학연구소 제3기술연구본부)
  • Received : 2018.10.30
  • Accepted : 2019.03.08
  • Published : 2019.04.05

Abstract

A Digital Transmitter/Receiver Module(DTRM), which is an essential part in active phased-array radar systems, generates a high heat density, and needs to be properly cooled for stable operation. A tile-type DTRM that is a stacking structure of multi-layer components was modeled with simplification and heat dissipation characteristics of the DTRM model were studied using computational fluid dynamics(CFD) simulations. Most of the heat was dissipated by the heat conduction through the cold plate, but the heat transfer by the forced convection on top of the DTRM also was found to play an important role in the thermal management. Under the given conjugated heat transfer environment, the DTRM was confirmed to secure a stable operating temperature range.

Keywords

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Fig. 1. The Computational Fluid Dynamics(CFD) simulation model. A) A DTRM on two cold plates, B) A cross section of DTRM

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Fig. 2. Components of DTRM in each layer. A) 1st layer, B) 2nd layer, C) 3rd layer, D) 4th layer

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Fig. 3. Temperature distributions inside/outside the DTRM under natural convection(NC, left) and forced convection(FC, right) conditions

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Fig. 4. Temperature distributions of the cold plates and A) 3rd layer & B) 4th layer of DTRM under natural convection(NC, left) and forced convection(FC, right) conditions

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Fig. 5. Maximum temperatures of the primary chips under natural convection(NC) and forced convection(FC) conditions

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Fig. 6. Heat removal rate of coolant/air under natural convection(NC) and forced convection(FC) conditions

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Fig. 7. Convergence results of FPGA average temperature with respect to A) the element number and B) iteration number

Table 1. Heat generation rate of the primary heat sources and the applied thermal pad thickness

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Table 2. Properties of the materials used in CFD simulations

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