References
- An, D., Ko, H-K., Kim, J., and Kim, S-S. 2009. "A Yields Prediction in the Semiconductor Manufacturing Process Using Stepwise Support Vector Machine." Journal of the Korean Institute of Industrial Engineers 22(3):252-262.
- Baek, D. H., and Han, C. H. 2003. "Application of Data mining for improving and predicting yield in wafer fabrication system." Journal of Intelligent Information Systems 9(1):157-177.
- Chien, C. F., Wang, W. C., and Cheng, J. C. 2007. "Datamining for yield enhancement in semiconductor manufacturing and an empirical study." Expert Systems with Applications 33(1):192-198. https://doi.org/10.1016/j.eswa.2006.04.014
- Chung, C. H. 2014 "Mixed Nano Silica Colloidal Slurry for Reliability Improvement of Sapphire Wafer CMP Process." Journal of Applied Reliability 14(1):11-19.
- Cunningham, S. P., Spanos, C. J., and Voros, K. 1995. "Semiconductor yield improvement: results and best practices, Semiconductor Manufacturing." IEEE Transactions on Semiconductor Manufacturing 8(2): 103-109. https://doi.org/10.1109/66.382273
- Hsu, S-C., and Chien, C-F. 2007. "Hybrid data mining approach for pattern extraction from wafer bin map to improve yield in semiconductor manufacturing." International Journal of Production Economics 107(1):88-103. https://doi.org/10.1016/j.ijpe.2006.05.015
- Krueger, D. C., Montgomery, D.C., and Mastrangelo, C. M. 2011. "Applocation of Generalized Linear Models to Predict Semiconductor Yield Using Defect Metrology Data." IEEE Transactions on Semiconductor Manufacturing 24(1):44-58. https://doi.org/10.1109/TSM.2010.2089377
- Lee, D. H., Lee, M. L., and Bae, S. J. 2015. "A Study on Optimal Operation Conditions for an Electronic Device Alignment System by Using Design of Experiments." Journal of the Korean Society for Quality Management 43(3):453-466. https://doi.org/10.7469/JKSQM.2015.43.3.453
- Lee, S. M., and Byeon, J. W. 2016. "Evaluation of Fracture Strength of Silicon Wafer for Semiconductor Substrate by Point Load Test Method." Journal of Applied Reliability 16(1):21-31.
- Lee, W. S. 2004. "Multi-response Optimization by a Response Surface Approach for a Taguchi-Type Multi-charateristic Experiments." Journal of Applied Reliability 4(1):39-64.
- Nam, W. S., Kim, S. B. 2015. "A Prediction of Wafer Yield Using Product Fabrication Virtual Metrology Process Parameters in Semiconductor Manufacturing." Journal of the Korean Institute of Industrial Engineers 41(6):572-578. https://doi.org/10.7232/JKIIE.2015.41.6.572
- Park, C. H., Baek, J. J., Yun, S-P., Koh, K. J., and Kim, Y. S. 2018. "Optimization of Air Pollutant Emissions in the Cement Firing Process Using a Response Surface Method." Journal of Applied Reliability 18(4):356-369. https://doi.org/10.33162/JAR.2018.12.18.4.356
- Shin, C. K., and Park, S. C. 2000. "A machine learning approach to yield management in semiconductor manufacturing." International Journal of Production Research 38(17):4261-4271. https://doi.org/10.1080/00207540050205073
- Sohn, S. Y., and Lee, S. G. 2012. "Probe test yield optimization based on canonical correlation analysis between process control monitoring variables and probe bin variables." Expert Systems with Applications 39(4):4377-4382. https://doi.org/10.1016/j.eswa.2011.09.155