반도체디스플레이기술학회지 (Journal of the Semiconductor & Display Technology)

한국반도체디스플레이기술학회 (The Korean Society Of Semiconductor & Display Technology)
권호 표지

전선피복용 컴파운드의 제조에서 가소제의 종류와 첨가량에 따른 물성 변화 연구

Study on Property Modification with Kind and Additive Amount of Plasticizer in the Manufacture of Compounds for Cable Sheath

  • 리시앙수 (한국기술교육대학교 에너지신소재화학공학과) ;
  • 이상봉 (한국기술교육대학교 에너지신소재화학공학과) ;
  • 조을룡 (한국기술교육대학교 에너지신소재화학공학과)
  • Li, Xiangxu (School of Energy, Materials, Chemical Engineering, Korea University of Technology and Education) ;
  • Lee, Sang Bong (School of Energy, Materials, Chemical Engineering, Korea University of Technology and Education) ;
  • Cho, Ur Ryong (School of Energy, Materials, Chemical Engineering, Korea University of Technology and Education)
  • 투고 : 2019.05.15
  • 심사 : 2019.06.18
  • 발행 : 2019.06.30
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초록

The four different polymer compounds were manufactured with the two kinds of plasticizers [(di-2-ethylhexyl sebacate(DOS), and di-2-butyl sebacate(DBS)] and two different additive amounts(18, 26 phr) of the same plasticizer for making cable sheath for ship. Ethylene-vinylacetate, ethylene-propylene-diene-copolymer as matrix polymers and ethylene-vinylacetate grafted maleic anhydride as coupling agent were selected for compounding with fire retardant, closslinking agent, filler, and other additives besides plasticizer. The compound including DOS showed the higher ${\Delta}T$ than that including DBS at the same additive amount in the rheology test. And with increasing plasticizer, the compounds resulted in lower tensile strength and higher elongation by lubricating effect of plasticizer. DOS yielded better aging resistance and cold resistance than DBS due to the good heat resistance and low solidifying point of DOS compared to DBS.

키워드

참고문헌

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