Fig. 1. Current efficiency and residual stress of Ni thin films electrodeposited on Cu test strip as a function of Ni concentrations in the baths: (a) current efficiency and (b) residual stress. Data points of 0.2 and 0.7 M were quoted from the Ref. no. [7].
Fig. 2. Dependence of surface morphology of Ni thin films coated on Cu test strip as a function of Ni concentrations in the baths: (a) 0.2 M, (b) 0.3 M, (c) 0.5 M, (d) 0.7 M and (d) 0.9 M.
Fig. 3. XRD patterns of Ni thin films coated on Cu test strip as a function of Ni concentrations in the plating baths. XRD patterns of 0.2 and 0.7 M were quoted from the Ref. no. [6] and [7], respectively.
Fig. 4. Average crystalline size calculated from the peaks in XRD pattern for Ni thin films coated on Cu test strip as a function of Ni concentrations in the baths. Data points of 0.2 and 0.7 M were quoted from the Ref. no. [6] and [7], respectively.
Table 1 Bath compositions and operating conditions (unless otherwise noted) for Ni thin films electrodeposited from chloride baths.
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