Fig. 1. Fabrication process and stack structure of the hybrid resistor.
Fig. 2. Resistance with temperature change of the MWCNT paper.
Fig. 3. Resistance with temperature change of the Cu/Mn alloy plate.
Fig. 4. TCR measured from the MWCNT paper, the Cu/Mn alloy plate, and the Hybrid resistor.
Table 1. Fabrication conditions of the MWCNT paper.
Table 2. Resistance and TCR data.
References
- E. M. Kim, S. H. Lee, D. K Cho, and S. H. Kim, Trans. Korean. Inst. Elect. Eng., 63, 1070 (2014). [DOI: https://doi.org/10.5370/kiee.2014.63.8.1070]
- J. H. Park and H. J. Cha, Trans. korean Inst. Power Electron., 7, 131 (2015).
- F. Galliana, P. P. Capra, and E. Gasparotto, Measurement, 46, 1630 (2013). [DOI: https://doi.org/10.1016/j.measurement.2012.11.031]
- S. S. Park, J. S. Koo, K. Y. Youn, and C. S. Kim, Proc. The Korean Society of Automotive Engineers Spring Conference Proceeding (The Korean Society of Automotive Engineers, Jeju, Korea, 2002) p. 1249.
- S. Yarlagadda, T. T. Hartley, and I. Husain, IEEE Trans. Ind. Appl., 49, 2720 (2013). [DOI: https://doi.org/10.1109/TIA.2013.2264794].
- M. S. Huh, S. W. Choi, H. G. Chun, S. C. Kwon, G. H. Lee, and T. Y. Cho, J. Vac. Soc., 6, 77 (1997).
- Y. G. Ko, C. W. Lee, S. NamGung, D. H. Lee, and D. H. Sin, Korean Soc. Technol. Plast., 18, 476 (2009). [DOI: https://doi.org/10.5228/KSPP.2009.18.6.476]
- E. M. Kim, S. C. Kim, and S. Lee, J. Korean Inst. Electr. Electron. Mater. Eng., 29, 365 (2016). [DOI: https://doi.org/10.4313/JKEM.2016.29.6.365]
- Y. Lim and S. Lee, J. Korean Inst. Electr. Electron. Mater. Eng., 30, 59 (2017). [DOI: https://doi.org/10.4313/JKEM.2017.30.1.59]