Advances in Computational Design

  • 제4권1호
  • /
  • Pages.33-41
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  • 2019
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  • 2383-8477(pISSN)
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  • 2466-0523(eISSN)
테크노프레스 (Techno-Press)
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DOI QR Code

Investigation of bonding properties of Al/Cu bimetallic laminates fabricated by the asymmetric roll bonding techniques

  • Vini, Mohamad Heydari (Department of Mechanical Engineering, Mobarakeh Branch, Islamic Azad University) ;
  • Daneshmand, Saeed (Department of Mechanical Engineering, Majlesi Branch, Islamic Azad University)
  • 투고 : 2018.07.01
  • 심사 : 2018.12.04
  • 발행 : 2019.01.25
⟨ 이전 논문 다음 논문 ⟩

초록

In this study, 2-mm Al/Cu bimetallic laminates were produced using asymmetric roll bonding (RB) process. The asymmetric RB process was carried out with thickness reduction ratios of 10%, 20% and 30% and mismatch rolling speeds 1:1, 1:1.1 and 1:1.2, separately. For various experimental conditions, finite element simulation was used to model the deformation of bimetallic Al/Cu laminates. Specific attention was focused on the bonding strength and bonding quality of the interface between Al and Cu layers in the simulation and experiment. The optimization of mismatch rolling speed ratios was obtained for the improvement of the bond strength of bimetallic laminates during the asymmetric RB process. During the finite element simulation, the plastic strain of samples was found to reach the maximum value with a high quality bond for the samples produced with mismatch rolling speed 1:1.2. Moreover, the peeling surfaces of samples around the interface of laminates after the peeling test were studied to investigate the bonding quality by scanning electron microscopy.

키워드

참고문헌

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