Electronics and Telecommunications Trends (전자통신동향분석)

Electronics and Telecommunications Research Institute (한국전자통신연구원)
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Laser-Assisted Bonding Technology for Interconnections of Multidimensional Heterogeneous Devices

다차원 이종 복합 디바이스 인터커넥션 기술 - 레이저 기반 접합 기술

  • Published : 2018.12.01
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Abstract

As devices have evolved, traditional flip chip bonding and recently commercialized thermocompression bonding techniques have been limited. Laser-assisted bonding is attracting attention as a technology that satisfies both the requirements of mass production and the yield enhancement of advanced packaging interconnections, which are weak points of these bonding technologies. The laser-assisted bonding technique can be applied not only to a two-dimensional bonding but also to a three-dimensional stacked structure, and can be applied to various types of device bonding such as electronic devices; display devices, e.g., LEDs; and sensors.

Keywords

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(그림 1) 플립 칩 인터커넥션

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(그림 2) 플립 칩 인터커넥션 공정도: (a) Flux dispense, (b) alignment, (c) reflow, (d) flux residue cleaning, (e) capillary underfill, (f) underfill curing

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(그림 3) 열 압착 인터커넥션 공정 기술

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(그림 4) TSV에 NCP를 적용하여 3초간 100W의 레이저를 조사하여 6단 적층된 TSV 칩의 각 층별 접합부 미세구조

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(그림 5) 3단을 적층한 이후 (a) 3초 동안 100W의 레이저를 조사하여 적층한 칩의 단면 SEM (b) 5초 동안 100W의 레이저를 조사하여 적층한 칩의 단면 SEM

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(그림 6) PET 필름 상에 8×20 LED 모듈을 실장하기 위해 적용된 레이저 타일링 조사 기법

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(그림 7) 하이브리드 언더필과 레이저를 이용하여 PET 필름에 접합된 8×20 LED 모듈

References

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