The Transactions of The Korean Institute of Electrical Engineers (전기학회논문지)

The Korean Institute of Electrical Engineers (대한전기학회)
권호 표지
DOI QR코드

DOI QR Code

Study on Electrical and Mechanical Properties of High Viscosity Solid Epoxy / Silica and Alumina Composite

고점도형 고상에폭시/실리카와 알루미나 콤포지트의 전기적, 기계적 특성연구

  • Park, Jae-Jun (Dept. of Electrical and Electronic Engineering, Joongbu University)
  • Received : 2018.07.30
  • Accepted : 2018.09.27
  • Published : 2018.10.01
Download PDF
⟨ Previous Next ⟩

Abstract

In this study, 40, 50, 60, and 70 wt% filler dispersed samples were prepared for the current GIS Spacer or environmentally friendly GIS. In the AC electrical breakdown, EMSC and EMAC decreased with increasing filler content, and EMSC showed better breakdown strength than EMAC. The mechanical properties such as tensile strength and flexural strength of EMSC and EMAC were also increased with increasing filler content. In addition, EMSC results in better mechanical properties than EMAC. The reason for this is considered to be one in which the influence of the interface is important.

Keywords

References

  1. T. Shimizu, S. Kinoshita, S. Makishima, J. Sato, O. Sakaguchi, "Material and Simulation Technology for Solid Insulated Switchgear", IEEE 7th International Conference on Properties and Application of Dielectric Materials (ICPADM), S22-5, pp. 1194-1197, 2003.
  2. J. Keith Nelson, J. C. Fothergill, "Internal charge behaviour of nanocomposites," Nanotechnology, Vol. 15, 2004.
  3. X. Huang, P. Jiang, and T. Tanaka, "A review of dielectric polymer composites with high thermal conductivity," IEEE Electr. Insul. Mag., Vol. 27, no. 4, pp. 8-16, 2011. https://doi.org/10.1109/MEI.2011.5954064
  4. Jae-Jun Park and Jae-Young Lee, "A New Dispersion Method for the Preparation of Polymer/Organoclay Nanocomposite in the Electric Fields", IEEE Transactions on Dielectrics and Electrical Insulation, Vol. 17, No. 5; pp. 1516-1522, October, 2010. https://doi.org/10.1109/TDEI.2010.5595553
  5. A. A. Cooper, R. J. Young, and M. Halsall, "Investigation in to the deformation of carbon nano tubes and their composites through the use of Raman spectroscopy," Compos. Part A: Appl. Sci. Manuf., Vol. 32, pp. 401-411, 2001. https://doi.org/10.1016/S1359-835X(00)00107-X
  6. N. Shanid, R. G. Villate, and A. R. Barron, "Chemically functionalized alumina nanoparticle effect on carbon fi ber/epoxy composites," Compos. Sci. Technol., Vol. 65, pp. 2250-2258, Nov. 2005. https://doi.org/10.1016/j.compscitech.2005.04.001
  7. Z. Ahmad, M. P. Ansell, and D. Smedley, "Thermal properties of epoxy based adhesive reinforced with nano and micro particles for in-situ timber bonding," Int. J. Eng. Technol., Vol. 10, no. 2, pp. 32-38, Mar. 2010.
  8. Q. Wang, G. Chen, and A. S. Alghamdi, "Influence of nanofillers on electrical characteristics of epoxy resins insulation," IEEE International Conference on Solid Dielectrics, 2010.
  9. T. Andritsch, R. Kochetov, P. H. F. Morshuis, and J. J. Smitt, "Dielectric properties and space charge behaviour of MgO-epoxy nanocomposites," IEEE International Conference on Solid Dielectrics, 2010.
  10. R. Kochetov, T. Andritsch, U. Lafont, P. H. F. Morshuis, S. J. Picken, and J. J. Smit, "Preparation and dielectric properties of epoxy-BN and epoxy-AlN nanocomposites," IEEE Electrical Insulation Conference, 2009.
  11. Jae-jun Park; Chang-hoon Lee; Jae-young Lee; Hee-dong Kim, "Preparation of epoxy/micro- and nanocomposites by electric field dispersion process and its mechanical and electrical properties", IEEE Transactions on Dielectrics and Electrical Insulation, Volume: 18, Issue: 3, pp.667-674, 2011. https://doi.org/10.1109/TDEI.2011.5931051
  12. Jae-Jun Park and Jae-Young Lee, "Effect of epoxy-modified silicone-treated micro-/nano-silicas on the electrical breakdown strength of epoxy/silica composites", IEEE Transactions on Dielectrics and Electrical Insulation, Volume: 24, Issue: 6, pp. 3794-3800, Dec. 2017. https://doi.org/10.1109/TDEI.2017.006609
  13. Guevara Morales, A., Taylor, A. C., Fu, M., Hyde, A., Perrot, F. "Nanoclay-filled epoxy composites for electrical insulation application", The Proceedings of 9th International Conference on Properties and Application of Dielectric Materials, Harbin, China, July 2009, pp. 868-871.
  14. Wang Qi, Li Zhe, Wu Jiandong and Yin Yi,"The thermal conductivity and electrical strength of epoxy resin with different filler content of micro and nano alumina", 2012 IEEE International Conference on Condition Monitoring and Diagnosis 23-27 September 2012, Bali, Indonesia, pp. 1110-1113, 2012.