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Study on Safety Management Plan through Chemical Accident Investigation in PCB Manufacturing Facility Etching Process

PCB 제조시설 에칭공정 화학사고 조사를 통한 안전관리 방안 연구

  • Park, Choon-Hwa (Siheung Joint Inter-agency Chemical Emergency Preparedness Center) ;
  • Kim, Hyun-Sub (Siheung Joint Inter-agency Chemical Emergency Preparedness Center) ;
  • Jeon, Byeong-Han (Department of Environmental Engineering, Ajou University) ;
  • Kim, Duk-Hyun (Department of Chemical Engineering & Biotechnology, Korea Polytechnic University)
  • 박춘화 (시흥화학재난합동방재센터) ;
  • 김현섭 (시흥화학재난합동방재센터) ;
  • 전병한 (아주대학교 환경공학과) ;
  • 김덕현 (한국산업기술대학교 생명화학공학과)
  • Received : 2018.01.17
  • Accepted : 2018.04.06
  • Published : 2018.04.30

Abstract

Although the number of chemical accidents has been declining since the Chemical Control Act of 2015, there have been repeated occurrences of similar types of accidents at printed circuit board (PCB) manufacturing facilities. These accidents were caused by the overflow of hydrochloric acid and hydrogen peroxide, which are toxic chemicals used in the printed circuit board manufacturing process. An analysis of the $Cl^-$ content to identify the cause of the accident showed that in the mixed route of hydrochloric acid and hydrogen peroxide, which are accidental substances, the $Cl^-$ concentration was 66.85 ppm in the hydrogen peroxide sample. Through reaction experiments, it was confirmed that the deformation of a PVC storage tank and generation of chlorine gas, which is a toxic gas, occurred due to reaction heat occurring up to $50.5^{\circ}C$. This paper proposes a facility safety management plan, including overcharge, overflow prevention, leak detection device, and separation tank design for mixing prevention in printed circuit board manufacturing facility etch process. To prevent the recurrence of accidents of the same type, the necessity of a periodic facility safety inspection and strengthening of the safety education of workers was discussed.

2015년 화학물질관리법 시행 이후 화학 사고 발생 수는 감소 추세에 있으나, 최근 인쇄회로기판(PCB) 제조시설에서 유사한 유형의 사고가 반복적으로 발생함에 따라 실험을 통해 사고 원인을 조사 분석하였다. 해당 사고는 인쇄회로기판 제조공정 내 에칭용액으로 사용한 유해화학물질인 염산과 과산화수소가 월류하여 발생한 사고로 작업자 부주의와 시설 관리 미흡이 주된 사고 원인으로 조사되었다. 사고 원인을 규명하기 위해 실시한 $Cl^-$의 함량 분석 결과 과산화수소 시료에서 66.85 ppm로 측정되어 사고 물질인 염산과 과산화수소의 혼합경로를 확인할 수 있었으며, 반응실험을 통해 반응열이 $50.5^{\circ}C$까지 발생함에 따라 PVC 저장탱크의 변형과 유독가스인 염소가스 발생을 확인하였다. 본 연구를 통해 인쇄회로기판 제조시설의 에칭공정에서의 과충전, 역류방지, 누출감지장치와 혼합방지를 위한 저장탱크 분리 설계 등 시설 안전 관리 방안과 해당 장치의 장외영향평가 검토 필요성을 제시하고자 하였다. 또한 동일 유형의 사고 재발 방지를 위하여 주기적인 시설 안전점검과 작업자의 안전교육 강화의 필요성에 대하여 논의하였다.

Keywords

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