참고문헌
- R. A. street, "Thin film transistor," Advanced Materials, vol.21. no.20, pp.2007-2022, 2009.DOI:10.1002/adma.200803211
- K. K. Song, D. J. Kim, X. S. Li, T. W. Jun, Y. M. Jeong and J. H. Moon, "Solution processed invisible all-oxide thin film transistors," Journal of Material Chemistry, vol.19, no.46, pp.8881-8886, 2009.DOI:10.1039/B912554J
- G. Huang, L. Duan, G. Dong, D. Zhang and Y. Qiu, "High-mobility solution-processed tin oxide thin-film transistors with high-k alumina dielectric working in enhancement mode," ACS Applied Material and Interfaces, 6(23), pp. 20786-20794. 2014.DOI:10.1021/am5050295
- K. Nomura, H, Ohta, A. Takagi, T. Kamiya, M. Hirano and H. hosono, "Room-temperature fabrication of transparent flexible thin-film transistors using amorphous oxide semiconductors," nature, 432, pp. 488-492, Nov. 2004.DOI:10.1038/nature03090
- R. L. Hoffman, B. J. Norris and J. F. Wager, "ZnO-based transparent thin-film transistors," Applied Physics Letters, vol.82, no.5, pp.733-735, 2003.DOI:10.1063/1.1542677
- S. C. Wang, C. F. Yeh, C. K. Huang and Y. T. Dai, "Device transfer technology by backside etching (DTBE) for poly-Si thin-film transistors on glass/plastic substrate," Japanese Journal of Applied Physics, vol.42, pp.1044-1046, 2003.DOI: 10.1143/JJAP.42.L1044
- Z. Wang, P. K. Nayak, J. A. Caraveo-Frescas and H. N. Alshareef, "Recent developments in p-type Oxide Semiconductor materials and devices," Advanced Materials, vol.28, no.20, pp. 3831-3892, 2016.DOI:10.1002/adma.201503080
- B. Balamurugan and B. R. Mehta, "Optical and structural properties of nanocrystalline copper oxide thin films prepared by activated reactive evaporation," Thin Solid Films, Vol.396, no.1-2, pp.90-96, 2001.DOI:10.1016/S0040-6090(01)01216-0
- C. Gu and J. K. Lee, "Patterning of amorphous-InGaZnO thin-film transistors by stamping of surface-modified polydimethylsiloxane," RCS Advances, no.49, 2016.DOI:10.1039/C6RA06264D
- H. Tavana, N. Petong, A. Hennig, K. Grundke and A. W. Neumann. "Contact angles and coating thickness," The Journal of Adhesion, vol.81, no.1, 2005.DOI:10.1080/00218460590904435