마이크로전자및패키징학회지 (Journal of the Microelectronics and Packaging Society)

  • 제25권4호
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  • Pages.149-154
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  • 2018
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  • 1226-9360(pISSN)
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  • 2287-7525(eISSN)
한국마이크로전자및패키징학회 (The Korean Microelectronics and Packaging Society)
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Chip-on-board 형 세라믹-메탈 하이브리드 기판을 적용한 50와트급 LED 어레이 모듈의 제조 및 방열특성 평가

Fabrication and Evaluation of Heat Transfer Property of 50 Watts Rated LED Array Module Using Chip-on-board Type Ceramic-metal Hybrid Substrate

  • 허유진 (한국세라믹기술원 나노융합소재센터) ;
  • 김효태 (한국세라믹기술원 나노융합소재센터)
  • Heo, Yu Jin (Nano Materials and Convergence Center, Korea Institute of Ceramic Engineering and Technology) ;
  • Kim, Hyo Tae (Nano Materials and Convergence Center, Korea Institute of Ceramic Engineering and Technology)
  • 투고 : 2018.12.04
  • 심사 : 2018.12.28
  • 발행 : 2018.12.31
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초록

가로등 및 방폭등용 고출력 LED 조명 시스템의 광원으로서, 다수의 LED 칩이 실장된 50와트급 LED 어레이 모듈을 chip-on-board형 고방열 세라믹-메탈 하이브리드 기판을 사용하여 제작하였다. 고방열 세라믹-메탈 하이브리드 기판은 고열전도 알루미늄 금속 열확산 기판에 저온소결용 글라스-세라믹 절연 페이스트와 은 전극 페이스트를 후막 스크린 공정에 의해 도포한 다음, 건조 후 $515^{\circ}C$에서 동시소성하여 LED 칩을 실장할 세라믹 절연층과 은전극 회로층을 형성하여 제조하였다. 이 하이브리드 기판의 방열특성 평가를 위한 비교 샘플로서 기존의 에폭시 기반 FR-4 복합수지로 만든 써멀비아형 PCB 기판에도 동일한 디자인의 LED 어레이 모듈을 제작한 다음, 다중채널 온도측정장치와 열저항 측정기로 방열특성을 비교 분석하였다. 그 결과, $4{\times}9$ type LED 어레이 모듈에서 세라믹-메탈 하이브리드 기판의 열저항은 써멀비아형 FR-4 기판에 비하여 약 1/3로 나타났으며, 이것은 곧 방열성능이 적어도 3배 이상 높은 것으로 볼 수 있다.

This paper describes the fabrication and heat transfer property of 50 watts rated LED array module where multiple chips are mounted on chip-on-board type ceramic-metal hybrid substrate with high heat dissipation property for high power street and anti-explosive lighting system. The high heat transfer ceramic-metal hybrid substrate was fabricated by conformal coating of thick film glass-ceramic and silver pastes to form insulation and conductor layers, using thick film screen printing method on top of the high thermal conductivity aluminum alloy heat-spreading panel, then co-fired at $515^{\circ}C$. A comparative LED array module with the same configuration using epoxy resin based FR-4 PCB with thermalvia type was also fabricated, then the thermal properties were measured with multichannel temperature sensors and thermal resistance measuring system. As a result, the thermal resistance of the ceramic-metal hybrid substrate in the $4{\times}9$ type LEDs array module exhibited about one third to the value as that of FR-4 substrate, implying that at least triple performance of heat transfer property as that of FR-4 substrate was realized.

키워드

MOKRBW_2018_v25n4_149_f0001.png 이미지

Fig. 1. Schematic illustration of chip-on-board (COB) type LED array module with ceramic-metal PCB: (a) single chip and (b) multichip mounted module.

MOKRBW_2018_v25n4_149_f0002.png 이미지

Fig. 2. Circuit diagram of 50 watts rated LED array module consisted of 36 LED chips.

MOKRBW_2018_v25n4_149_f0003.png 이미지

Fig. 3. Schematic illustration of LED array module with thermal-via type FR-4 PCB: (a) single chip and (b) multichip mounting module.

MOKRBW_2018_v25n4_149_f0004.png 이미지

Fig. 4. Optical images of fabricated 50 watts rated LED array module panels: circuit layout of 4 × 9 LEDs arrayed on ceramic-metal hybrid PCB panel (a) without top protection layer, (b) with top protection layer, and (c) comparative LED array module made with thermal-via FR-4 PCB.

MOKRBW_2018_v25n4_149_f0005.png 이미지

Fig. 5. Measurement of Ta in 50 watts LED array modules using multipoint temperature sensors (without thermal tape): (a) with COB type ceramic-metal PCB, (b) temperature measuring point, and (c) with thermal-via type FR-4 PCB.

MOKRBW_2018_v25n4_149_f0006.png 이미지

Fig. 6. (a) Thermal resistance data obtained by cumulative structure functions of 50 watts rated 4 × 9 LEDs array modules with (I) COB type ceramic-metal PCB and (II) thermal-via type FR-4 PCB and (b) equivalent thermal resistances and thermal capacitances circuit by Cauer-type RC ladder model.

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