한국기계가공학회지 (Journal of the Korean Society of Manufacturing Process Engineers)

  • 제17권5호
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  • Pages.111-116
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  • 2018
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  • 1598-6721(pISSN)
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  • 2288-0771(eISSN)
한국기계가공학회 (The Korean Society of Manufacturing Process Engineers)
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분자동역학을 이용한 PMMA 평판의 열접합 및 분리에 대한 연구

Investigation of Thermal Fusion Bonding and Separation of PMMA Substrates by using Molecular Dynamics Simulations

  • 이태일 (경남대학교 기계공학부)
  • Yi, Taeil (Department of Mechanical Engineering, Kyungnam University)
  • 투고 : 2018.08.14
  • 심사 : 2018.08.25
  • 발행 : 2018.10.31
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초록

Thermal fusion bonding is a method to enclose open microchannels fabricated on polymer chips for use in lab-on-a-chip (LOC) devices. Polymethyl methacrylate (PMMA) is utilized in various biomedical-microelectromechanical systems (bio-MEMS) applications, such as medical diagnostic kits, biosensors, and drug delivery systems. These applications utilize PMMAs biochemical compatibility, optical transparency, and mold characteristics. In this paper, we elucidate both the conformational entanglement of PMMA molecules at the contact interfacial regime, and the qualitative nature of the thermal fusion bonding phenomena through systematic molecular dynamics simulations.

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참고문헌

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