초록
In recent years, the solar cell market has steadily grown with the demand for new energies. And wire sawing is one of the most critical processes in manufacturing solar cell wafer which is supposed to affect the breakage of wafers most during the process and afterwards. Generally, the defects of the wafers are generated from the structural vibrations of the machine. In the sawing process, the vibrations cause unnecessary normal stress on the cut surface of wafers, and eventually create the surface damage or leave the residual stress. In this study, the dynamic properties of a wire saw have been analyzed through the frequency response test and the computer simulation. And the effects of the design alterations have been investigated to stabilize the machine structure and further to reduce the vibrations. The result shows that relatively simple design alterations of supporting structure without any change of major parts of the machine can suppress the vibrations of the machine effectively.
