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A Study on the BGA Package Measurement using Noise Reduction Filters

잡음제거 필터를 이용한 BGA 패키지 측정에 관한 연구

  • Jin, Go-Whan (Division of IT Convergence Woosong University)
  • Received : 2017.09.01
  • Accepted : 2017.11.20
  • Published : 2017.11.28

Abstract

Recently, with the development of the IT industry, interest in computer convergence technology is increasing in various fields. Especially, in the semiconductor field, a vision system that uses a camera and computer convergence is often used to inspect semiconductor device defects in the production process. Various systems have been studied to remove noise, which is a major cause of degradation in processing of data related to these image processing systems. In this paper, we try to detect defects in BGA (Ball Grid Array) package devices by recognizing defects in advance during mass production. We propose a measurement system using a Gaussian filter, a Median filter, and an Average filter, which are widely used for noise reduction of image data Applying the proposed system to the manufacturing process of the BGA package can be used to judge whether the defect is good or not, and it is expected that productivity will be improved.

최근 IT 산업의 발전으로 다양한 분야에서 컴퓨터 융합 기술에 대한 관심이 높아지고 있다. 특히 반도체 분야에서 생산 공정에 반도체 소자의 결함을 검사하기 위하여 카메라와 컴퓨터를 융합한 비전 시스템을 많이 사용하고 있다. 이러한 영상 관련 시스템들은 데이터를 처리하는 과정에서 열화 현상이 발생하기에 주유한 요인인 잡음을 제거하기 위한 다양한 연구가 이루어지고 있다. 이에 본 논문에서는 BGA 패키지 소자를 대상으로 양산 과정에서 결함을 사전에 인식하여 불량을 검출하기 위하여 영상 데이터의 잡음제거에 많이 사용하고 있는 가우시안 필터, 미디언 필터, 평균 필터를 이용한 측정 시스템을 제안한다. 제안 시스템을 BGA 패키지 생산 공정에 적용하면 신속하게 양품과 불량을 판정할 수 있어 생산성이 향상될 것으로 기대된다.

Keywords

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