반도체디스플레이기술학회지 (Journal of the Semiconductor & Display Technology)

한국반도체디스플레이기술학회 (The Korean Society Of Semiconductor & Display Technology)
권호 표지

OLED의 Barrier와 Encapsulation을 위한 원자층 증착 기술로 공정된 Al2O3/TiO2/Al2O3 다층 필름

Characterization of ALD Processed Al2O3/TiO2/Al2O3 Multilayer Films for Encapsulation and Barrier of OLEDs

  • 투고 : 2017.02.06
  • 심사 : 2017.03.20
  • 발행 : 2017.03.31
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초록

Encapsulation of organic based devices is essential issue due to easy deterioration of organic material by water vapor. Thin layer of encapsulation film is required to preserve transparency yet protecting materials in it. Atomic layer deposition(ALD) is a promising solution because of its low temperature deposition and quality of the deposited film. $Al_2O_3$ or $Al_2O_3/TiO_2/Al_2O_3$ multilayer film has shown excellent environmental protection characteristics despite of thin thicknesses of the films. $Al_2O_3/TiO_2/Al_2O_3$ multilayer and 1.5 dyad layer of $Al_2O_3/polymer/Al_2O_3$ deposited by ALD was measured to have water vapor transmittance rate(WVTR) well below the detection limit($5.0{\times}10^{-5}g/m^2day$) of MOCON Aquatran 2 equipment.

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참고문헌

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