DOI QR코드

DOI QR Code

국내개발 MMIC칩을 적용한 W-Band 송수신모듈 개발

Development of W-band Transceiver Module using Manufactured MMIC

  • 투고 : 2017.03.07
  • 심사 : 2017.04.07
  • 발행 : 2017.04.30

초록

저잡음 증폭기, 믹서, 로컬 증폭기와 온도보상회로를 포함하는 다채널 수신 블록이 단일 MMIC 칩으로 설계 및 제작되었다. 이 국내개발 MMIC 칩을 송수신 모듈내에 장착하고 제작하여 송수신 모듈의 잡음지수와 변환이득 등을 측정하였으며, 또한 상용 칩을 장착하여 제작한 송수신모듈의 측정 결과와 이를 비교하였다. 결과적으로 국내개발 MMIC 칩을 이용한 송수신모듈이 상용 MMIC 칩을 이용한 송수신 모듈보다 잡음지수 및 평탄도 등에서 국내 개발 칩이 더 변환이득 특성이 좋으며, 채널당 이득 차이는 각각 0.5dB과 1.5dB이고 위상 차이는 각각 1.06도와 3.93도로 비교적 국내 개발 칩이 우수한 특성을 보였다.

The dual-channel receiver MMIC which is composed of LNA, Mixer, LO-amp and temperature compensation circuit is designed on a single chip. For the performance comparison, a FMCW radar transceiver module using commercial MMICs is also implemented. As a result, Multi-channel Transceiver using manufactured MMIC shows an improved performance such as noise figure and gain flatness compare to purchased MMIC.

키워드

참고문헌

  1. An Official Gazette No 16322, Radio Wave Research Institute No 2006-84, 2006. 8. 23.
  2. J. Y. Hong. "Car radar trend using Millimeter Wave," ETRI Journal, Vol.22, No.5, Oct. 2007, pp.35-45.
  3. Sangho Lee, "W-band dual channel receiver with active power divider and on-chip temperature -compensation circuit," (To be published)
  4. Long, A.P., et al.: 'Wideband HEMT MMIC low-noise amplifier with temperature compensation', Electronic Letters, 1994, 30,(5), pp.422-423 https://doi.org/10.1049/el:19940297
  5. Yamanaka, K., et al.: 'Ku-band Low Noise MMIC Amplifier with Bias Circuit for Compensation of Temperature Dependence and Process Variation', IEEEMTT-S Int. Microw. Symp. Dig., 2002, 3, pp.1427-1430
  6. Shin, S.-C., et al.: 'A temperature variation compensated 60-GHz low-noise amplifier in 90-nm CMOS technology', Asia-PacificMicrow. Conf. Proceedings, 2011, pp. 211-214
  7. Kawai, S., etal.:'A temperature variation tolerant 60GHz Low Noise Amplifier with current compensated biascircuit', IEEE Asian Solid-State Circuits Conf., 2013, pp.429-432
  8. Y. Deguchi, K. Sakakibara, N. Kikuma, and H. Hirayama, "Millimeterwave microstrip-to-waveguide transition operating over broad frequency bandwidth," in IEEE MTT-S Int. Microw. Symp. Dig., Jun. 2005, pp. 2107-2110.
  9. H. Iizuka, T. Watanabe, K. Sato, and K. Nishikawa, "Millimeterwave microstrip line to waveguide transition fabricated on a single layer dielectric substrate," IEICE Trans. Commun., vol. E85-B, no. 6, pp. 1169-1177, Jun. 2002.
  10. K. Seo, K. Sakakibara, and N. Kikuma, "Microstrip-to-waveguide transition using waveguide with large broad-wall in millimeter-wave band," in Proc. IEEE Int. Conf. Ultra-Wideband, Sep. 2010, pp. 1-4.
  11. Sun-il Kim "Design and fabrication of SSPA module in Ku band for satellite terminals," in Journal of Institute of Internet, Broadcasting and Communication(IIBC) vol. 16, No. 4, pp.59-64 Aug. 31, 2016. DOI: http://dx.doi.org/10.7236/JIIBC.2016.16.4.59