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피인용 문헌
- 차세대 전력반도체 소자 및 패키지 접합 기술 vol.26, pp.3, 2017, https://doi.org/10.6117/kmeps.2019.26.3.015
- 파워모듈의 TLP 접합 및 와이어 본딩 vol.26, pp.4, 2017, https://doi.org/10.6117/kmeps.2019.26.4.007
- Recent Progress in Transient Liquid Phase and Wire Bonding Technologies for Power Electronics vol.10, pp.7, 2020, https://doi.org/10.3390/met10070934