References
- Flexible Flat Panel Displays, Gregory P. Crawford, John Wiley & Sons, Ltd, 2005.
- J. Y. Kim, S. I. Hong, A Study on the Resistance and Crack Propagation of ITO/PET Sheet with 20 nm Thick ITO Film, Journal of the Korean Ceramic Society, 46 [1] (2009) 86-93. https://doi.org/10.4191/KCERS.2009.46.1.086
- T. Ono, M. Agari, S. Mori, T. Imamura, T. Miyayama, T. Nakamura, N. Nakagawa, Highperformance large-area projected capacitive touch screen using double layered metal mesh electrodes, Society for Information Display International Symposium digest of technical papers, 44 [S1] (2013) 215-218.
- M. Aryal, J. Geddes, O. Seitz, J. Wassel, I. McMackin, B. Kobrin, Sub-Micron Transparent Metal Mesh Conductor for Touch Screen Displays, Society for Information Display Symposium Digest of Technical Papers 45 [1] (2014) 194-196.
- Y. M. Choi, K. Y. Kim, E. S. Lee, T. M. Lee, Reverse-Offset Printed Single-layer Metal-Mesh Touch Screen Panel, Society for Information Display Symposium Digest of Technical Papers, 45 [1] (2014) 197-199.
- I. Nojiri, T. Ono, M. Agari, S. Mori, T. Imamura, T. Miyayama, T. Nakamura, N. Nakagawa, High- Performance Mutual-Capacitive Touch Screen using Double-Layered Metal-Mesh Electrodes with Separated Floating Electrodes, Society for Information Display Symposium Digest of Technical Papers, 45 [1] (2014) 544-547.
- L. Wu, W. He, D. Teng, S. Ji, C. Ye, A New Route To Fabricate Large-Area, Compact Ag Metal Mesh Films with Ordered Pores, Langmuir, 28[19] (2012) 7476-7483. https://doi.org/10.1021/la300788r
- H. W. Miao, J. G. Duh, Microstructure Evolution in Sn-Bi and Sn-Bi-Cu Solder Joints Under Thermal Aging, Materials Chemistry and Physics 71 (2001) 255-271. https://doi.org/10.1016/S0254-0584(01)00298-X
- T. H. Kim, The Ag paste manufacture for metal mesh touch sensor and characteristic study using the low-melting alloy (Sn58Bi), Master Thesis, (2014) Kyungpook National University.
- N.F. Uvarov, Estimation of Composites Conductivity Using a General Mixing Rule, Solid State Ionics, 136-137 (2000) 1267-1272. https://doi.org/10.1016/S0167-2738(00)00585-3
-
H. W. Choi, Y. W. Heo, J. H. Lee, J. J. Kim, H. Y. Lee, E. T. Park, Y. K. Chung, Effects of Ni Particle Size on Dielectric Properties of PMMANi-
$BaTiO_3$ Composites, Integrated Ferroelectrics, 87 (2007) 85-93. https://doi.org/10.1080/10584580601085511 - A. Sihvola, Mixing Rules with Complex Dielectric Coefficients. Subsurface Sensing Technologies and Applications 1 (2000) 393-415. https://doi.org/10.1023/A:1026511515005
- Y. P. Mamunya, Y. V. Muzychenko, P. Pissis, E. V. Lebedev, and M. I. Shut, Percolation Phenomena in Polymers Containing Dispersed Iron. J. Polymer Engineering, 42 (2002) 90-100. https://doi.org/10.1002/pen.10930
-
Y. Xiong, H. Wang, Z. Fu, Transient liquid-phase sintering of AlN ceramics with
$CaF_2$ additive, Journal of the European Ceramic Society, 33 [11] (2013) 2199-2205. https://doi.org/10.1016/j.jeurceramsoc.2013.03.024 - H. Feng, J. Huang, J. Yang, S. Zhou, R. Zhang, S. Chen, A Transient Liquid Phase Sintering Bonding Process Using Nickel-Tin Mixed Powder for the New Generation of High-Temperature Power Devices, Journal of Electronic Materials, 46 [7] (2017) 4125-4159.
- H. Greve, L. Chen, I. Fox, F. McCluskey, Transient Liquid Phase Sintered Attach for Power Electronics, 2013 IEEE 63rd Electronic Components & Technology Conference, (2013) 435-440.