DOI QR코드

DOI QR Code

에폭시/마이크로/나노알루미나 혼합된 멀티-콤포지트의 유전 특성

Dielectric Properties of Epoxy/Micro/Nano Alumina Multi-Composites

  • 박재준 (중부대학교 전기전자공학과)
  • Park, Jae-Jun (Department of Electrical Elecrtonic Engineering, Joongbu University)
  • 투고 : 2016.08.17
  • 심사 : 2016.08.24
  • 발행 : 2016.09.01

초록

In this work, the complex permittivity of epoxy resins is measured. Epoxy resins, epoxy with micro size fillers and epoxy with micro+nano alumina composites have been evaluated for dielectric properties according to frequency variation. The dielectric spectroscopy measurement and analyses are carried out in the frequency range of $10^{-2}Hz$ to 1MHz and constant to room temperature. The results of dielectric loss suggest that significant improvement in the electrical performance can be expected by using samples containing nano and micro fillers mixture when compared to materials containing only microfillers. As the result, we verified the specific characteristics of dielectric permittivity and dielectric loss namely, relative permittivity become low with improving dispersibility of nano+micro mixture composites and become rise with agglomerate of nano particles.

키워드

참고문헌

  1. K. Kadotani, Composites, 11, 199-204 (1980). [DOI: http://dx.doi.org/10.1016/0010-4361(80)90425-5]
  2. J. C. Fothergill, J. K. Nelson, and M. Fu, Electrical Insulation and Dielectric Phenomena, CEIDP '04 (2004 Annual Report Conference, 2004) p. 406-409.
  3. T. Tanaka, M. Kozako, N. Fuse, and Y. Ohki, IEEE Transaction on Dielectrics and Electrical Insulation, 12, 669-681 (2005). [DOI: http://dx.doi.org/10.1109/TDEI.2005.1511092]
  4. T. Imai, G. Komiya, and K. Murayama, Electrical Insulation (Conference Record of the 2008 IEEE International Symposium, 2008) p. 201-204.
  5. I. A. Tsekmes, R. Kochetov, P.H.F. Morshuis, and J. J. Smit, J. Mater. Sci., 50, 1175-1186 (2015). [DOI: http://dx.doi.org/10.1007/s10853-014-8674-5]
  6. I. A. Tsekmes, R. Kochetov, P.H.F. Morshuis, and J. J. Smit (IEEE Electrical Insulation Conference (EIC), 2015) p. 446-449. [DOI: http://dx.doi.org/10.1109/ICACACT.2014.7223609]
  7. I. A. Tsekmes, R. Kochetov, P.H.F. Morshuis, and J. J. Smit, Electrical Insulation and Dielectric Phenomena (CEIDP) (IEEE Conference, 2015) p. 479-482.
  8. R. Kochetov, T. Andritsch, P.H.F. Morshuis, and J. J. Smit, Electrical Insulation (ISEI) (IEEE International Symposium, 2010) p. 1-5.
  9. Y. Chen, J. Guo, Z. Shao, Y. Cheng, J. Wu, and T. Tanaka, IEEE 11th International Conference on the Properties and Applications of Dielectric Materials (ICPADM, 2015) p. 297-300.
  10. S. Singha, M. J. Thomas, and A. Kulkarni, IEEE Transactions on Dielectrics and Electrical Insulation, 17, 1249-1258 (2010). [DOI: http://dx.doi.org/10.1109/TDEI.2010.5539697]
  11. M. G. Veena, N. M. Renukappa, K. N. Shivakumar, and S. Seetharamu, Properties and Applications of Dielectric Materials (ICPADM) (IEEE 10th International Conference, 2012) p. 1-4.
  12. S. Singha and M. J. Thomas, IEEE Transactions on Dielectrics and Electrical Insulation, 15, 2-11 (2008). [DOI: http://dx.doi.org/10.1109/T-DEI.2008.4446731]
  13. F. W. Star, T. B. Schroder, and S. C. Glotzer, Phys. Rev. E, 64, 021802-021802 (2001). [DOI: http://dx.doi.org/10.1103/PhysRevE.64.021802]
  14. J. Castellon, H. N. Nguyen, S. Agnel, A. Toureille, M. Frechette, S. Savoie, and A. Krivda, IEEE Transactions on Dielectrics and Electrical Insulation, 18, 651-658 2011 https://doi.org/10.1109/TDEI.2011.5931049
  15. M. Kurimoto, H. Watanabe, K. Kato, N. Hayakawa, M. Hanai, Y. Hoshina, M. Takei, and H. Okubo, Properties and Applications of Dielectric Materials, ICPADM 2009 (IEEE 9th International Conference, 2009) p. 749-752. [DOI: http://dx.doi.org/10.1109/ICPADM.2009.5252320]
  16. S. Singha and M. J. Thomas, IEEE Transaction on Dielectrics and Electrical Insulation, 15, 12-13 (2008). [DOI: http://dx.doi.org/10.1109/T-DEI.2008.4446732]