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열전소자 내부 층간 결함과 열성능 관계에 관한 연구

Research on the Relationship between Thermoelectric Module with Defects and Thermal Performances

  • 최철준 (조선대학교 일반대학원 첨단부품소재공학과) ;
  • 고가진 (조선대학교 일반대학원 기계시스템공학과) ;
  • 김재열 (조선대학교 기계시스템공학과) ;
  • 정윤수 (조선대학교 일반대학원 기계시스템공학과)
  • Choi, Choul-Jun (Dept. of Advanced Parts and Materials Engineering, Graduate School of Chosun UNIV.) ;
  • Gao, Jia-Chen (Dept. of Mechanical System Engineering, Graduate School of Chosun UNIV.) ;
  • Kim, Jae-Yeol (Dept. of Mechanical System Engineering, Chosun UNIV.) ;
  • Jung, Yoon-Soo (Dept. of Mechanical System Engineering, Graduate School of Chosun UNIV.)
  • 투고 : 2016.06.22
  • 심사 : 2016.08.02
  • 발행 : 2016.08.31

초록

From the first application of a thermoelectric module to nowtoday, it has been more than half a century. The application of a thermoelectric module is becoming more and more widely accepted since, people's requirement rely more and more on the efficiency of thermoelectric modules and their reliability become higher and higher. So people pay more and more attention to the thermoelectric module. In Around the world, the more research for into improving the efficiency of thermoelectric modules is focused on the current materials. at present. However, the research of into available materials had has some limitations, and the research of materials had reached a bottleneckthere are limits to current applications. On the other hand, from the production process, if we assembled by materials withoutmodules without any damages and achieve the ideal state of a joint, we can make the a product to maximize performance and have a longer service life. SoTherefore, in this study we will prove the relationship between the any defects inside and the efficiency of a thermoelectric module to improve the quality management and performance of modern thermoelectric modules at present.

키워드

참고문헌

  1. Ioffe, A. F., "Semiconductor thermoelements and thermoelectric cooling" Inforsearch Ltd. London, 1957.
  2. Majumdar, A., "Thermoelectricity in semiconductor nano structures", Science, Vol. 303, No. 5659, pp. 777-778, 2004. https://doi.org/10.1126/science.1093164
  3. Hicks, L. D. and Dresselhaus, M. S., "Thermoelectric figure of merit of a one-dimensional conductor", Physical Review B, Vol. 47, No. 24, pp. 16631-16634, 1993. https://doi.org/10.1103/PhysRevB.47.16631
  4. Ro, S. T. and Seo, J. S., "Principles of Thermoelectric Refrigeration and System Design", Korean Journal of Air-Conditioning and Refrigeration Engineering, Vol. 19, No. 3, pp. 135-145, 1990.
  5. Lee, J. K., "Study on Optimization for Heating System of Sequential Feed-Type Mobile Smart Device Cover Glass Molding Machine", Journal of the Korean Society of Manufacturing Process Engineers, Vol. 14, No. 5, pp. 75-80, 2015. https://doi.org/10.14775/ksmpe.2015.14.5.075
  6. Nolas, G. S., Sharp, J. and Goldsmid, H. J., Thermoelectrics: Basic Principles and New Materials Developments, Springer, 2001.
  7. Kwon, H. H., "Development of Hybrid Composite Die for the Production of the Supercapacitor", Journal of the Korean Society of Manufacturing Process Engineers, Vol. 14, No. 1, pp. 105-110, 2015. https://doi.org/10.14775/ksmpe.2015.14.1.105
  8. Kim, S. T., Lee, S. J. and Choi, Y. H., "Thermal Characteristics Analysis of a High Speed Spindle System by Using FSI Method", Journal of the Korean Society of Manufacturing Process Engineers, Vol. 13, No. 3, pp. 83-88, 2014.
  9. Cho, Y. T., Lee, Ch. H., "Performance Evaluation of Heat Radiant for 50W LED by the CNT Thermal Interface Material", Journal of the Korean Society of Manufacturing Process Engineers, Vol. 13 No. 6, pp. 23-29, 2014.
  10. Yun, S. U., Kim, J. Y., Choi, S. H. and Kim, H. W., "Inspection System of Coating Layers by Thermal Behavior Effect", Journal of the Korean Society of Manufacturing Process Engineers, Vol. 13 No. 6, pp. 1-7, 2014.