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Thermal Analysis of APD Electronics for Activation of a Spaceborne X-band 2-axis Antenna

위성 데이터 전송용 2축 짐벌식 X-band 안테나 구동용 전장품 APD 열 해석

  • Ha, Heon-Woo (Satellite Technology Research Center, Korea Advanced Institute of Science and Technology) ;
  • Kang, Soo-Jin (Space Technology Synthetic Laboratory, Dept. of Aerospace Engineering, Chosun University) ;
  • Kim, Tae-Hong (School of Mechatronics, Gwangju Institute of Science and Technology) ;
  • Oh, Hyun-Ung (Space Technology Synthetic Laboratory, Dept. of Aerospace Engineering, Chosun University)
  • 하헌우 (한국과학기술원 인공위성연구센터) ;
  • 강수진 (조선대학교 항공우주공학과 우주기술융합연구실) ;
  • 김태홍 (광주과학기술원 기전공학부) ;
  • 오현웅 (조선대학교 항공우주공학과 우주기술융합연구실)
  • Received : 2016.01.11
  • Accepted : 2016.02.11
  • Published : 2016.06.30

Abstract

The thermal analysis of electronic equipment is required to predict the reliability of electronic equipment being loaded on a satellite. The transient heat transfer of electronic equipment that was developed recently has been generated using a large-scale integration circuit. If there is a transient heat transfer between EEE(Electric, Electronic and Electro mechanical) parts, it may lead to failure the satellite mission. In this study, we performed the thermal design and analysis for reliability of APD(Antenna Pointing Driver) electronics for activation of a spaceborne X-band 2-axis antenna. The EEE parts were designed using a thermal mathematical model without the thermal mitigation element. In addition, thermal analysis was performed based on the worst case for verifying the reliability of EEE parts. For the thermal analysis results, the thermal stability of electronic equipment has been demonstrated by satisfying the de-rating junction temperature.

Keywords

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