Journal of the Semiconductor & Display Technology (반도체디스플레이기술학회지)

The Korean Society Of Semiconductor & Display Technology (한국반도체디스플레이기술학회)
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A Study on Performance Evaluation of Typical Classification Techniques for Micro-cracks of Silicon Wafer

실리콘 웨이퍼 마이크로크랙을 위한 대표적 분류 기술의 성능 평가에 관한 연구

  • Kim, Sang Yeon (Graduate school, Korea National University of Transportation) ;
  • Kim, Gyung Bum (Aeronautical & Mechanical Design Engineering, Korea National University of Transportation)
  • 김상연 (한국교통대학교 대학원) ;
  • 김경범 (한국교통대학교 항공.기계설계학과)
  • Received : 2016.08.11
  • Accepted : 2016.09.23
  • Published : 2016.09.30
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Abstract

Silicon wafer is one of main materials in solar cell. Micro-cracks in silicon wafer are one of reasons to decrease efficiency of energy transformation. They couldn't be observed by human eye. Also, their shape is not only various but also complicated. Accordingly, their shape classification is absolutely needed for manufacturing process quality and its feedback. The performance of typical classification techniques which is principal component analysis(PCA), neural network, fusion model to integrate PCA with neural network, and support vector machine(SVM), are evaluated using pattern features of micro-cracks. As a result, it has been confirmed that the SVM gives good results in micro-crack classification.

Keywords

References

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