Journal of Electrical Engineering and Technology

The Korean Institute of Electrical Engineers (대한전기학회)
권호 표지
DOI QR코드

DOI QR Code

Signal Integrity Analysis of High Speed Interconnects In PCB Embedded with EBG Structures

  • Sindhadevi, M. (Dept. of Electronics and Communication Engineering, Anna University) ;
  • Kanagasabai, Malathi (Dept. of Electronics and Communication Engineering, Anna University) ;
  • Arun, Henridass (Dept. of Electronics and Communication Engineering, Anna University) ;
  • Shrivastav, A. K. (SAMEER, Center for Electromagnetics)
  • Received : 2015.04.15
  • Accepted : 2015.08.27
  • Published : 2016.01.01
Download PDF
⟨ Previous Next ⟩

Abstract

This paper brings out a novel method for reducing Near end and Far end Crosstalk using Electromagnetic Band Gap structures (EBG) in High Speed RF transmission lines. This work becomes useful in high speed closely spaced Printed Circuit Board (PCB) traces connected to multi core processors. By using this method, reduction of −40dB in Near-End Crosstalk (NEXT) and −60 dB in Far End Crosstalk (FEXT) is achieved. The results are validated through experimental measurements. Time domain analysis is performed to validate the signal integrity property of coupled transmission lines.

Keywords

References

  1. R. Abhari and G. V. Eleftheriades, “Metallo-dielectric electromagnetic band gap structures for suppression and isolation of parallel-plate noise in high speed circuits,” IEEE Trans. Microw. Theory Tech., vol. 51, no. 6, pp. 1629-1639, Jun. 2003. https://doi.org/10.1109/TMTT.2003.812555
  2. T. L. Wu, Y. H. Lin, T. K. Wang, and T. Hay, “Electromagnetic band gap power/ground planes for wideband suppression of ground bounce noise and radiated emission in high speed circuits,” IEEE Trans. Microw. Theory Tech., vol. 53, no. 5, pp. 2935-2942, Sep. 2005. https://doi.org/10.1109/TMTT.2005.854248
  3. T. L. Wu, Y.-H. Lin, and S.-T. Chen, “A novel power planes with low radiation and broadband suppression of ground bounce noise using photonic bandgap structures,” IEEE Trans. Microw. Wireless Compon. Lett., vol. 14, no. 7, pp. 337-339, Jul. 2004. https://doi.org/10.1109/LMWC.2004.829275
  4. J. Choi, V. Govin, and M. Swaminathan, “A novel electromagnetic bandgap (EBG) structure for mixed-signal system applications,” in Proc. IEEE Int. Symp. Radio Wireless Conf., 2004, pp. 243-246.
  5. S. Shahparnia and O. M. Ramahi, “Electromagnetic interference (EMI) and reduction from printed circuit boards (PCB) using electromagnetic bandgap structures,” IEEE Trans. Electromagn. Compat., vol. 46, no. 4, pp. 580-587, Nov. 2004. https://doi.org/10.1109/TEMC.2004.837671
  6. S. Shahparnia and O. M. Ramahi, “A simple and effective model for electromagnetic bandgap structures embedded in printed circuit boards,” IEEE Microw. Wireless Compon. Lett., vol. 15, no. 10, pp. 621-623, Oct. 2005 https://doi.org/10.1109/LMWC.2005.856695
  7. J. Qin and O. M. Ramahi, “Ultra-wideband mitigation of simultaneous switching noise using novel planar electromagnetic bandgap structures,” IEEE Microw. Wireless Compon. Lett., vol. 16, no. 9, pp. 487-489, Sep.2006. https://doi.org/10.1109/LMWC.2006.880713
  8. T. Kamgaing and O. M. Ramahi, “A novel power plane with integrated simultaneous switching noise mitigation capability using high impedance surface,” IEEE Microw.Wireless Compon. Lett., vol. 13, no. 1, pp. 21-23, Jan. 2003. https://doi.org/10.1109/LMWC.2002.807713
  9. M.-S. Zhang, Y.-S. Li, C. Jia, and L.-P. Li, “Signal integrity analysis of the traces in electromagnetic-bandgap structure in high speed printed circuit boards and packages,” IEEE Trans. Microw. Theory Tech., vol. 55, no. 5, pp. 1054-1062, May 2007. https://doi.org/10.1109/TMTT.2007.895413
  10. T.-K.Wang, T.-W. Han, and T.-L.Wu, “A novel power/ground layer using artificial substrate EBG for simultaneously switching noise suppression,” IEEE Trans. Microw. Theory Tech., vol. 56, no. 5, pp. 1164-1171, May 2008. https://doi.org/10.1109/TMTT.2008.921642
  11. Cheng-Chi Yu, Meng-Hsiang Haung, Yao-Tien Chang, Luen-Kang Lin, and Tsung-Han Weng, “A Novel Electromagnetic Bandgap (EBG) Structure for Electromagnetic Compatibility (EMC) Application,” Progress In Electromagnetics Research Symposium, Beijing, China, March 23-27, 2009.
  12. Hui-Sun He, Xin-Quan Lai, Wen-Dan Xu, Jian-Guo Jang, Ming-Xiang Zang, Qiang Ye, Qiang Wang, “Efficient EMI Reduction in Mulitlayer PCB using Novel Wideband Electromagnetic Band gap structures,” International Jouranl of RF an d Microwave Computer Aided Engineering, Vol. 21, No. 4, July 2011.
  13. Henridass A Sindhadevi.M, Karthik N. Alsath, M.G.N, Kumar R.R, Malathi K, “Defective ground plane structure for broadband crosstalk reduction in PCBs,” IEEE explore, ICCA-10.1109/ICCCA.2012.6179208, 2012.
  14. Montrose, M.L., EMC and the Printed Circuit Board : Design, Theory and layout Made Simple, IEEE Press, 1998.
  15. Jong Hwa Kwon, Dong Uk Sim, Sang il Kwak, Jong Gwan Yook, “Novel Electromagnetic Bandgap Array Structure On Power Distribution Network For Suppressing Simultaneous Switching Noise And Minimizing Effects On High-Speed”, IEEE transactions on Electromagnetic Compatibility, Vol. 52, 365-372, 2010. https://doi.org/10.1109/TEMC.2010.2045894
  16. Patnam Hanumantha Rao, Madhavan Swaminathan, “A Novel Compact Electromagnetic Bandgap Structure in Power Plane for Wideband Noise Suppression and Low Radiation”, IEEE transactions on Electromagnetic Compatibility, Vol. 53, No. 4, 996-1004, 2011. https://doi.org/10.1109/TEMC.2011.2156408
  17. Spartaco Caniggia, Francescaromana Maradei, “Signal integrity and Radiated emission of high speed digital systems”, John Wiley & Sons, 2008.
  18. Sindhadevi, M, Henridass, A, Malathi, K & Srivastav, AK 2013, ‘Crosstalk Reduction Using Defective Ground Plane Structures in RF Printed Circuit Boards’, Arabian Journal of Science and Engineering (AJSE), Vol.39, Issue 2, pp1107-1116, February 2014. https://doi.org/10.1007/s13369-013-0720-0
  19. Fan yang and Yahya Rahmat Samii, “Electromagnetic Band gap structures in Antenna Engineering”, Cambridge university press, 2009.
  20. W.-T. Huang C.-H. Lu and D.-B. Lin “Suppression Of Crosstalk Using Serpentine Guard Trace Vias” Progress In Electromagnetics Research, Vol. 109, 37-61, 2010. https://doi.org/10.2528/PIER10090504
  21. T. Kamgaing and O. M. Ramahi, “A novel power plane with integrated simultaneous switching noise mitigation capability using high impedance surface,” IEEE Microw. Wireless Compon. Lett., vol. 13, no. 1, pp. 21-23, Jan. 2003. https://doi.org/10.1109/LMWC.2002.807713
  22. S. Kahng, K. Jang, J. Jeon, H. Oh "A Metamaterial-Inspired and Embedded Structure to damp the Resoance of the Power/Ground PI planes", Proceedings of EMC Tokyo 2014 (2014 International Symposium on Electromagnetic Compatibility), pp. 109-112.
  23. Asanee Suntives, Arash Khajooeizadeh, Ramesh Abhari. “Using Via Fences for Crosstalk Reduction in PCB Circuits’, IEEE proceedings, pp. 34-37, 2006.
  24. K. Lee, H.-B. Lee, H.-K. Jung, J.-Y. Sim, and H.-J. Park, “Serpentine guard trace to reduce far-end crosstalk and even-odd mode velocity mismatch of microstrip lines by more than 40%,” in Electron. Compon. Technol. Conf., Reno, NV, 2007, pp. 329-332.
  25. Ding-Bing Lin, Chen-Kuang Wang, Chi-Hao Lu, and Wen-Tzeng Huang, “Using Rectangular shape Resonators to Improve the Far-end Crosstalk of the Coupled Microstrip Lines”, PIERS Proceedings, 2011.
  26. Morteza Kazerooni, Mohammad Ali Salari, Ahmad,” A Novel Method for Crosstalk Reduction in Coupled Pair Microstrip Lines”. International Journal of RF and Microwave Computer-Aided Engineering/Vol. 22, No. 2, March 2012.

Cited by

  1. Novel TDR Test Method for Diagnosis of Interconnect Failures Using Automatic Test Equipment vol.66, pp.10, 2017, https://doi.org/10.1109/TIM.2017.2712978