한국생산제조학회지 (Journal of the Korean Society of Manufacturing Technology Engineers)

  • 제25권1호
  • /
  • Pages.62-67
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  • 2016
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  • 2508-5093(pISSN)
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  • 2508-5107(eISSN)
한국생산제조학회 (The Korean Society of Manufacturing Technology Engineers)
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전사방법을 이용한 폴리머 필름에 내재된 실리콘 나노구조물 어레이 제작

Fabrication of a Silicon Nanostructure Array Embedded in a Polymer Film by using a Transfer Method

  • Shin, Hocheol (Department of Mechanical System Design Engineering, Seoul National University of Science & Technology) ;
  • Lee, Dong-Ki (Graduate School of NID Fusion Technology, Seoul National University of Science & Technology) ;
  • Cho, Younghak (Department of Mechanical System Design Engineering, Seoul National University of Science & Technology)
  • 투고 : 2016.01.27
  • 심사 : 2016.02.14
  • 발행 : 2016.02.15
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초록

This paper presents a silicon nanostructure array embedded in a polymer film. The silicon nanostructure array was fabricated by using basic microelectromechanical systems (MEMS) processes such as photolithography, reactive ion etching, and anisotropic KOH wet etching. The fabricated silicon nanostructure array was transferred into polymer substrates such as polymethyl methacrylate (PMMA), polyethylene terephthalate (PET), and polycarbonate (PC) through the hot-embossing process. In order to determine the transfer conditions under which the silicon nanostructures do not fracture, hot-embossing experiments were performed at various temperatures, pressures, and pressing times. Transfer was successfully achieved with a pressure of 1 MPa and a temperature higher than the transition temperature for the three types of polymer substrates. The transferred silicon nanostructure array was electrically evaluated through measurements with a semiconductor parameter analyzer (SPA).

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참고문헌

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  1. A Study on Doping Effect of Silver Nanoparticles in Silicon Laser Sintering vol.28, pp.1, 2019, https://doi.org/10.7735/ksmte.2019.28.1.37