한국표면공학회지 (Journal of Surface Science and Engineering)

  • 제49권6호
  • /
  • Pages.549-554
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  • 2016
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  • 1225-8024(pISSN)
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  • 2288-8403(eISSN)
한국표면공학회 (The Korean Institute of Surface Engineering)
권호 표지
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기계적/전기화학적 표면처리가 알루미늄-에폭시의 접합강도 향상에 미치는 영향

Effect of Mechanical and Electrochemical Surface Treatments on Aluminium-Epoxy Adhesive Strength

  • Chung, Won-Sub (Departments of Materials Science and Engineering, Pusan National University) ;
  • Kim, Do-Hyung (Departments of Materials Science and Engineering, Pusan National University)
  • 투고 : 2016.12.15
  • 심사 : 2016.12.30
  • 발행 : 2016.12.31
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초록

Low melting metals are difficult to weld because it is vaporized. But epoxy resin make bonding possible using low melting material and dismissal materials. This study is to improve the bonding strength of epoxy and substrate by mechanical and electrochemical methods. In case of mechanical work, bonding strength is 17.6MPa and in case of pre-work, bonding strength is 15.3MPa. When anodizing and mechanical work is applied, bonding strength is 25.3Mpa is increased 165%. When anodizing is applied, bonding strength is 27.6Mpa.

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참고문헌

  1. Jun Hee Song and Jae Kyoo Lim, Bonding Strength in Structural Adhesive Bonded Joint, Met. Mater. Int. 7 (2001) 467-470. https://doi.org/10.1007/BF03027088
  2. Youngsik Kim and Sangcheol Kim, Latest Joining Technology of Metal and Plastics, J. Welding and Joining 34 (2016) 31-39. https://doi.org/10.5781/JWJ.2016.34.3.31
  3. E. Juntunen, A. Sitomaniemi, O. Tapaninen, R. Persons, M. Challingsworth, and V. Heikkinen, Thermal Performance Comparison of Thick-Film Insulated Aluminum Substrate With Metal Core PCBs for High-Power LED Modules, IEET. T. Compon, Pack. Man. 2 (2012) 1957-1964.
  4. E. Juntunen, O. Tapaninem, A. Sitomaniemi, M. Jamsa, V. Heikkinen, M. Karppinen and P. Karioja, Copper-Core MCPCB with Thermal Vias for High-Power COB LED Modules, IEET. T. Power. Electr. 29 (2014) 1410-1417. https://doi.org/10.1109/TPEL.2013.2260769
  5. W. K. C. Yung, Using Metal Core Printed Circuit Board(MCPCB) as a Solution for Thermal Management, J. HKPCA. Q2 (2007) 12-16.
  6. T. P. Hoar and N. F. Mott, A MECHANISM FOR THE FORMATION OF POROUS ANODIC OXIDE FILMS ON ALUMINIUM, J. Phys. Chem. Solids. 9 (1959) 97-99. https://doi.org/10.1016/0022-3697(59)90199-4
  7. S. Mohagheghi, A. Hatefim and A. Kianvash, Effect of $H_3PO_4$ anodizing variations on Al-epoxy adhesion strength, Surf. Eng. 29 (2013) 737-742. https://doi.org/10.1179/1743294413Y.0000000158
  8. D. E. Packham, K. Bright, and B. W. Malpass, Mechanical factors in the adhesion of polyethylene to aluminum, J. Appl. Polym. Sci. 18 (1974) 3237-3247. https://doi.org/10.1002/app.1974.070181105
  9. A. Belwalkar, E. Grasing, W. Van Geertruyden, Z. Huang and W. Z. Misiolek, Effect of Processing Parameters on Pore Structure and Thickness of Anodic Aluminum Oxide (AAO) Tubular Membranes, J. Membrane. Sci. 319 (2008) 192-198. https://doi.org/10.1016/j.memsci.2008.03.044
  10. J. -C. K. Woo Lee, U. Gosele, Spontaneous Current Oscillations during Hard Anodization of Aluminum under potentiostatic Conditions, Adv. Funct. Mater. 40 (2010) 21-27.
  11. L. Zaraska, G. D. Sulka, M. Jaskula, The effect of n-alcohols on porous anodic alumin formed by self-organized two-step anodizing of aluminum in phosphoric acid, Surf. Coat. Tech. 204 (2010) 1729-1737. https://doi.org/10.1016/j.surfcoat.2009.10.051
  12. S. K. Lee, D. H. Kim, Y. M. Kim, U. C. Jung and W. S. Chung, Effect of Aluminum Anodizing in Phosphoric Acid Electrolyte on Adhesion Strength and Thermal Performance, Met. Mater. Int. 22 (2016) 20-25. https://doi.org/10.1007/s12540-015-5426-2
  13. J. -S. Zhang, X. -H. Zhao, Y. Zuo and J. -P. Xiong, The bonding strength and corrosion resistance of aluminum alloy by anodizing treatment in a phosphoric acid modified boric acid/sulfuric acid bath, Surf. Coat. Tech. 202 (2008) 3149-3156. https://doi.org/10.1016/j.surfcoat.2007.10.041
  14. R. P. Digby and D. E. Packham, Pretreatment of aluminum: topography, surface chemistry and adhesive bond durability, Int. J. Adhes. Adhes. 15 (1995) 61-71. https://doi.org/10.1016/0143-7496(95)98739-9
  15. O. Lunder, B. Olsen and K. Nisancioglu, Pretreatment of AA6060 aluminium alloy for adhesive bonding, Int. J. Adhes. Adhes. 22 (2002) 143-150 https://doi.org/10.1016/S0143-7496(01)00049-5
  16. S. H. Han, M. Kim, D. Y. Chang and B. H. Rho, Effects of Pretreatment on the Adhesive Bonding of Aluminium Plate, J. Kor. Inst. Surf. Eng. 25 (1992) 97-102.