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확산 접합에 의해 제조된 텅스텐-레늄 합금/티타늄/그래파이트 접합체의 미세구조 및 고온 안정성

Interfacial Microstructure of Diffusion-Bonded W-25Re/Ti/Graphite Joint and Its High-Temperature Stability

  • Kim, Joo-Hyung (Department of Materials Science and Engineering, Korea Advanced Institute of Science and Technology) ;
  • Baek, Chang Yeon (Department of Materials Science and Engineering, Korea Advanced Institute of Science and Technology) ;
  • Kim, Dong Seok (Korea Atomic Energy Research Institute) ;
  • Lim, Seong Taek (Agency for Defense Development) ;
  • Kim, Do Kyung (Department of Materials Science and Engineering, Korea Advanced Institute of Science and Technology)
  • 투고 : 2016.11.01
  • 심사 : 2016.11.16
  • 발행 : 2016.12.27

초록

Graphite was diffusion-bonded by hot-pressing to W-25Re alloy using a Ti interlayer. For the joining, a uniaxial pressure of 25 MPa was applied at $1600^{\circ}C$ for 2 hrs in an argon atmosphere with a heating rate of $10^{\circ}C\;min^{-1}$. The interfacial microstructure and elemental distribution of the W-25Re/Ti/Graphite joints were analyzed by scanning electron microscopy (SEM). Hot-pressed joints appeared to form a stable interlayer without any micro-cracking, pores, or defects. To investigate the high-temperature stability of the W-25Re/Ti/Graphite joint, an oxy-acetylene torch test was conducted for 30 seconds with oxygen and acetylene at a 1.3:1 ratio. Cross-sectional analysis of the joint was performed to compare the thickness of the oxide layer and its chemical composition. The thickness of W-25Re changed from 250 to $20{\mu}m$. In the elemental analysis, a high fraction of rhenium was detected at the surface oxidation layer of W-25Re, while the W-25Re matrix was found to maintain the initial weight ratio. Tungsten was first reacted with oxygen at a torch temperature over $2500^{\circ}C$ to form a tungsten oxide layer on the surface of W-25Re. Then, the remaining rhenium was subsequently reacted with oxygen to form rhenium oxide. The interfacial microstructure of the Ti-containing interlayer was stable after the torch test at a temperature over $2500^{\circ}C$.

키워드

참고문헌

  1. K. Upadhya, J. Yang and W. Hoffman, DTIC Document, (1997).
  2. F. J. Huegel and W. R. Holman, J. Electrochem. Soc., C103, 117 (1970).
  3. N. V. Gelfond, N. B. Morozova, E. S. Filatov, S. A. Gromilov and I. K. Igumenov, J. Struct. Chem., 1126, 50 (2009).
  4. S. R. Yang, C. W. Tan, X. D. Yu, K. X. Liu, Z. K. Wang, Y. D. Wang, H. L. Ma, F. C. Wang and H. N. Cai, Surf. Coat. Technol., 38, 265 (2015).
  5. T. G. Nieh, J. Mater. Sci., 2327, 21 (1986).
  6. A. K. Jadoon, B. Ralph and P. R. Hornsby, J. Mater. Process. Tech., 257, 152 (2004).
  7. R. Pan, Q. Wang, D. L. Sun and P. He, J. Eur. Ceram. Soc., 219, 35 (2015).
  8. Y. I. Jung, J. Y. Park, B. K. Choi, J. S. Lee, H. G. Kim, D. J. Park, J. H. Park, S. K. Kim, D. W. Lee and S. Cho, Fusion Eng. Des., 109, 448 (2016).
  9. T. Hayashi, S. Takaoka, A. Ichida, H. Ohara and T. Yoshioka, Mater. Manuf. Process., 1047, 9 (1994).
  10. R. L. Mannheim and J. L. Garin, Key Eng. Mater., 302, 189 (2001).
  11. M. Naka, J. C. Feng and J. C. Schuster, Metall. Mater. Trans. A, 1385, 28 (1997).
  12. S. B. Li, L. T. Zhang and L. F. Cheng, Mater. Sci. Technol., 1494, 18 (2002).
  13. L. T. Zhang and J. S. Wu, Scr. Mater., 307, 38 (1997).
  14. J. H. Schneibel and C. J. Rawn, Acta Mater., 3843, 52 (2004).