ETRI Journal

  • 제37권2호
  • /
  • Pages.387-394
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  • 2015
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  • 1225-6463(pISSN)
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  • 2233-7326(eISSN)
한국전자통신연구원 (Electronics and Telecommunications Research Institute)
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Interconnection Technology Based on InSn Solder for Flexible Display Applications

  • Choi, Kwang-Seong (IT Convergence Technology Research Laboratory, ETRI) ;
  • Lee, Haksun (IT Convergence Technology Research Laboratory, ETRI) ;
  • Bae, Hyun-Cheol (IT Convergence Technology Research Laboratory, ETRI) ;
  • Eom, Yong-Sung (IT Convergence Technology Research Laboratory, ETRI) ;
  • Lee, Jin Ho (IT Convergence Technology Research Laboratory, ETRI)
  • 투고 : 2014.02.08
  • 심사 : 2014.11.28
  • 발행 : 2015.04.01
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초록

A novel interconnection technology based on a 52InSn solder was developed for flexible display applications. The display industry is currently trying to develop a flexible display, and one of the crucial technologies for the implementation of a flexible display is to reduce the bonding process temperature to less than $150^{\circ}C$. InSn solder interconnection technology is proposed herein to reduce the electrical contact resistance and concurrently achieve a process temperature of less than $150^{\circ}C$. A solder bump maker (SBM) and fluxing underfill were developed for these purposes. SBM is a novel bumping material, and it is a mixture of a resin system and InSn solder powder. A maskless screen printing process was also developed using an SBM to reduce the cost of the bumping process. Fluxing underfill plays the role of a flux and an underfill concurrently to simplify the bonding process compared to a conventional flip-chip bonding using a capillary underfill material. Using an SBM and fluxing underfill, a $20{\mu}m$ pitch InSn solder SoP array on a glass substrate was successfully formed using a maskless screen printing process, and two glass substrates were bonded at $130^{\circ}C$.

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참고문헌

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피인용 문헌

  1. Electrical Reliability of a Film-Type Connection during Bending vol.4, pp.4, 2015, https://doi.org/10.3390/electronics4040827
  2. Sn58Bi Solder Interconnection for Low-Temperature Flex-on-Flex Bonding vol.38, pp.6, 2015, https://doi.org/10.4218/etrij.16.0115.0945
  3. Characterization of transmission lines with through-silicon-vias and bump joints on high-resistivity Si interposers for RF three-dimensional modules vol.55, pp.6, 2016, https://doi.org/10.7567/jjap.55.06jc01
  4. A flexible skin patch for continuous physiological monitoring of mental disorders vol.71, pp.8, 2015, https://doi.org/10.3938/jkps.71.462
  5. Microstructure Evolution and Shear Strength of Tin-Indium-xCu/Cu Joints vol.12, pp.1, 2015, https://doi.org/10.3390/met12010033